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LOCTITE ABLESTIK CDF 530P, highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metal leadframes. This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes. It can be used in a variety of die sizes ranging from 3mm x 3mm to 8mm x 8mm .
LOCTITE ABLESTIK CDF 530P offers high MSL reliability, controlled fillet size and does not exhibit resin bleed out. It has good wetting and low warpage on large dies and is recommended for thin wafer handling applications. It comes in 15 (CDF 515P) and 30um and is typically used for QFN, TQFP and eTQFP package applications.
CDF 500P - Die attach film property comparison