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LOCTITE® ABLESTIK CDF 625P silver filled, die attach adhesive film is the most universal film, recommended for large die applications. It is suitable for bonding integrated circuits and components with low warpage and good adhesion (>5MPA) on laminates and metal finishes. Furthermore, it has the lowest total cost of ownership and covers a wide die size range up to 10x10mm.
LOCTITE® ABLESTIK CDF 625P has a broad application space with controlled 25um bondline and a low modulus that is very close to Ablestik 8322A (2000 MPa @ RT, 40 MPa @ 250C.). This conductive die attach film can be effectively used for other applications and can also be a potentially replacement for QMI519.
CDF 600P - Die attach film property comparison