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LOCTITE ABLESTIK CDF 815P highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes. It can be used in a variety of die sizes ranging from 0.2mm x 0.2mm to 4mm x 4mm.
LOCTITE ABLESTIK CDF 815P exhibits high MSL reliability and excellent in package thermal and electrical resistance. It is typically used for die attach in QFN, SOIC and SO packages.
CDF 800P - Die attach film property comparison