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LOCTITE ABLESTIK CE 3104WXL is an electrically conductive epoxy adhesive that is a Pb-free alternative to solder. It is a rigid, silver filled epoxy that can be heat cured in low temperatures and is typically used for SMD component attach on non-noble Sn, Sn/Pb and OSP coated Cu substrates.
LOCTITE ABLESTIK CE 3104WXL uses a unique blend of fillers with tightly controlled particle sizes to provide ultra-fine pitch resolution (<500µm) when printed using either a stainless steel mesh screen or a metal mask stencil. The lower surface tension versus solder means no bridging on fine-pitch assembly patterns.
In the following image you can see that the CE 3104WXL stencil printing results with 25um stencil showing that 80-100um dot diameter with 100um spacing (or 200um pitch) look good, but smaller dots and pitch are getting tricky.
The results are color coded so 100um spacing exhibits proper printing with larger dot diameters.