Harmonization Code : 3920.99.28.90 |   Other plates, sheets, film, foil and strip, of plastics, non-cellular and not reinforced, laminated, supported or similarly combined with other materials ; Of other plastics ; Other; Other
Main features
  • Uniform bondline
  • Even heat dissipation
  • Passes NASA ougassing

Product Description

LOCTITE ABLESTIK CF 3350 epoxy assembly film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance. It is typically used to bond circuit board materials, metal backplanes and heatsinks and can be applied on fluoropolymer, ceramic, copper, brass, kovar and aluminum substrates. On top of that, this assembly film offers a high thermal conductivity of 7 W/mK.

LOCTITE ABLESTIK CF 3350 is a gray, flexible, thermally and electrically conductive film that provides electrical continuity and minimum thermal resistance to the heatsink . It meets the NASA outgassing standards and the requirements of MIL-STD-883, Method 5011 for adhesives.


Cure Schedule

  • 30 minutes @ 150°C 
  • 10 minutes @ 175°C or
  • 50 minutes @ 137°C or
  • 120 minutes @ 125°C
Product Family
10 x 12 inch sheet
0.05 0.1

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Technical Specifications

General Properties
Collected Volatile Condensable Materials
0.03 %
Total Mass Loss
0.16 %
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 270 days
Work life @25°C
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.
2184 hours
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
50 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
5 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
30 ppm
Mechanical Properties
Tensile Modulus
Tensile Modulus
Tensile modulus is a mechanical property that measures the stiffness of an elastic material. It is the slope of stress / strain curve of a material under direct tensile loading.

It can be used to predict the elongation or elastic deformation of an object as long as the stress is less than the tensile strength of the material. Elastic deformation is caused by stretching the bonds between atoms and the deformation can be reversed when the load is removed.

Tensile modulus is affected by temperature and is an important engineering attribute since we generally want to keep elastic deformation as small as possible.
Tensile Modulus @150°C 60 N/mm2
Tensile Modulus @25°C 2,400 N/mm2
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
2.0x10-4 Ohms⋅cm
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
65 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
150 ppm/°C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
90 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
7 W/m.K

Additional Information

Assembly Films like LOCTITE ABLESTIK CF 3350 are used for very large dies, even up to 15mm2. These silver filled films with 7 W/mK bulk conductivity are widely used in Defense and Aerospace and other RF applications and are available in 50 and 100um thickness in 10 x 12” sheet form. These films can be cut in size and cured under a heated press up to 0.4 MPa pressure.

Assembly adhesive films can be used in radar systems which are vital for improving flight safety and efficiency. Assembly of higher functioning circuit boards must consider heat build up to preserve reliability. Aerospace engineers prefer assembly films for thermal management in circuit assembly. These films remove heat from the circuit board in a safe and reliable way by connecting it to a heat sink. They evenly distribute adhesive, resulting in consistent bond lines and achieving a robust thermal management while providing a strong reliable bond and electrical grounding. These films can be custom cut into intricate preform designs by a laser, die cutter or knife plotter. This way we can have precise amounts of material placed exactly where it's needed. LOCTITE films are the industry standard and are relied on by manufacturers around the world for consistent and robust performance in aerospace assembly.