Product Description
LOCTITE ABLESTIK ECF 563 unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. This adhesive provides RF/EMI shielding in bonding microwave substrates into packages.
LOCTITE ABLESTIK ECF 563 assembly adhesive film has very low squeeze oute during bonding and passes NASA outgassing standards.
Cure Schedule
- 30 minutes @ 150°C
- 2 hours @ 125°C