Product Description
LOCTITE ABLESTIK QMI 2569 is a wide temperature processing, no-dry, silver glass die attach adhesive for the attachment of integrated circuits in both solder seal and glass seal hermetic packages. The material can allow the simultaneous processing of die attach and leadframe embedding, while producing a void-free bondline for maximum thermal dissipation.
LOCTITE ABLESTIK QMI 2569 shows excellent adhesion when processed between 380°C to 440°C for small die (.300” x .300”), and between 390°C to 440°C for large die. Excellent RGA moisture results are acquired through the use of lead borate glass. This paste can only be used in hermetic packages. The QMI 2569 also offers improved processability by allowing in-line drying during the firing process on die as large as .800” x .800”. Either multi-needle or starfish can apply the material.
LOCTITE ABLESTIK QMI2569 can only be used in hermetic packaging applications.