Product Description
LOCTITE® ABLESTIK QMI505MT die attach paste is designed for attachment of integrated circuits and components to advanced metal and ceramic surfaces. A package or device manufactured with LOCTITE ABLESTIK QMI505MT will have good resistance to delamination and “popcorning” after exposure to reflow temperatures.
LOCTITE® ABLESTIK QMI505MT is a hydrophobic, electrically conductive rubberized epoxy with low modulus that reduces inter package stress. This silver filled adhesive has excellent interfacial adhesion strength and is stable at high temperatures. Typically used for SBGA, OFN and TQFP packages and on gold, silver, ceramic, palladium and alloy42 surface finishes.
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