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LOCTITE® ABLESTIK QMI529HT-LV is a thermally and electrically conductive, hydrophobic die attach paste with good dispensing characteristics. It exhibits low moisture absorption, excellent adhesion and low stress while also being thermally stable at 260ºC reflow temperatures. QMI529HT-LV has great adhesion on lower temperatures works great on Ag/Au finish and while it does work on Ni finish, a more custom curing schedule might be required.
LOCTITE® ABLESTIK QMI529HT-LV can be dispensed on a faster rate and is considered an upgraded version of QMI 529HT.
LOCTITE® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications and successfully passes NASA outgassing, MIL-STD-883 and Method5011 standards. It has been tested in 5x5mm die and it has demonstrated exceptional die shear strength @ 270°C after being cured for 60m at 190°C.
Curing instructions might vary per product and customer application. Some general guidelines that have worked in the past are the following:
Still having issues? Check the Technical data sheet or reach out to us for an alternative recommendations.