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LOCTITE® ABLESTIK SSP 2020 Silver sintering die attach adhesive is designed for devices requiring high thermal and electrical conductivity.It can reach around 200 W/mK when pressure is applied during sintering, making it one of the most thermally conductive die attach materials available. The only thing that can potentially go higher than that is pure silver at 400 W/mK. Please note that SSP stands for Silver Sintering and not semi sintering.
LOCTITE ABLESTIK SSP 2020 is formulated to provide high heat transfer generated from power devices and maintain high adhesion at operating temperatures as high as 260ºC. It is a solvent based silver sintering material that is typically not suitable for semiconductor die attach MSL requirements.
Pressureless Sintering Process
Ag or Au Leadframe sinter
Direct Bonded Copper (DBC)
Pressure Sintering Process
Air dry 40 minutes @ 120ºC then sinter 2 minutes @ ≥250 °C at >10 MPa pressure