Harmonization Code : 3506.91.90.99 |   Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
  • High thermal conductivity
  • High electrical conductivity
  • High die shear strength

Product Description

LOCTITE® ABLESTIK SSP 2020 Silver sintering die attach adhesive  is designed for devices requiring high thermal and electrical conductivity.It can reach around 200 W/mK when pressure is applied during sintering, making it one of the most thermally conductive die attach materials available. The only thing that can potentially go higher than that is pure silver at 400 W/mK. Please note that SSP stands for Silver Sintering and not semi sintering.

LOCTITE ABLESTIK SSP 2020 is formulated to provide high heat transfer generated from power devices and maintain high adhesion at operating temperatures as high as 260ºC. It is a solvent based silver sintering material that is typically not suitable for semiconductor die attach MSL requirements.

Product Family
5cc Syringe

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Technical Specifications

General Properties
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -40°C 183 days
Work life @25°C
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.
18 hours
Physical Properties
Thixotropic index
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
19,000 mPa.s
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
1 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
1 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
1 ppm
Mechanical Properties
Tensile Modulus
Tensile Modulus
Tensile modulus is a mechanical property that measures the stiffness of an elastic material. It is the slope of stress / strain curve of a material under direct tensile loading.

It can be used to predict the elongation or elastic deformation of an object as long as the stress is less than the tensile strength of the material. Elastic deformation is caused by stretching the bonds between atoms and the deformation can be reversed when the load is removed.

Tensile modulus is affected by temperature and is an important engineering attribute since we generally want to keep elastic deformation as small as possible.
Tensile Modulus @100°C 9,740 N/mm2
Tensile Modulus @150°C 8,290 N/mm2
Tensile Modulus @200°C 6,970 N/mm2
Tensile Modulus @25°C 12,490 N/mm2
Tensile Modulus @250°C 5,615 N/mm2
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
4.8x10-5 Ohms⋅cm
Thermal Properties
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
>100 W/m.K

Additional Information

Pressureless Sintering Process

Ag or Au Leadframe sinter

  • 10 minute ramp to 250°C + 60 minutes @ 250°C (Conventional Air Circulated Oven)
  • 10 minute ramp to 250°C + 60 minutes @ 250°C (N2 Oven)

Direct Bonded Copper (DBC)

  • 10 minute ramp to 200°C + 60 minutes @ 200°C (on Au)
  • 10 minute ramp to 250°C + 60 minutes @ 250°C (on Ag)


Pressure Sintering Process

Air dry 40 minutes @ 120ºC then sinter 2 minutes @ ≥250 °C at >10 MPa pressure