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LOCTITE ECCOBOND 3185 heat curable silicone adhesive is designed for thermally enhanced flip chip BGA applications. This material is sensitive to amines, phospines, acids and sulfur containing materials.
LOCTITE ECCOBOND 3185 needs to be isolated from uncured epoxy-based resins as interaction will inhibit curing. Interaction will inhibit curing. It is typically used for bonding ICs to integrated heat spreaders in laminate BGA applications.