OPTOLINQ TMC-2100IR | Transparent Molding Compound

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

OPTOLINQ TMC-2100IR | Transparent Molding Compound

Main features

Low moisture absorption
Superior moldability and reliability
For IR Applications

Product Description

OPTOLINQ TMC-2100IR is a high-performance transparent epoxy molding compound. Engineered for precision IR applications, TMC-2100IR offers exceptional spiral flow, minimal moisture absorption, and superior moisture resistance. OPTOLINQ TMC-2100IR is formulated to achieve optimal moldability and long-term reliability optoelectronic components.

OPTOLINQ TMC-2100IR comes in different sizes to meet various mold design requirements. Contact us for custom sizes or other specific requirements.

Key Features

High IR Transparency: Ensures superior infrared light transmission for optimal device performance.
Low Moisture Absorption & Excellent Moisture Resistance: Effectively prevents moisture ingress, safeguarding long-term reliability.
Reliable Under Harsh Conditions: Maintains consistent performance in environments with elevated temperature and humidity.
High Adhesion & Low Stress: Provides strong, durable bonding with minimal internal stress, reducing risk of delamination or cracking.

Typical Applications

Low-Power LED & Emitters
Pulse Oximeter Sensors
Ambient Light Sensors
IR and Near-IR Sensors
Data transmission and industrial fibers.

Versions Available

Standard Low stress optical molding compound - TMC-2100
Increased self-release formulation technology - TMC-2100H
Superior IR optical transparency - TMC-2100IR

Alternative to: XX-8524 Series, XX-824H, XX-330H

Specifications
Additional Information

Technical Specifications

General Properties

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.2-1.25

Mechanical Properties

Hardness Hardness Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Durometer (Shore D)	80

Flexural Modulus
Flexural Modulus @ 25°C	2600-3400 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	110 N/mm2

Molded Shrinkage

1.5 %

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE) , α1 Coefficient of Thermal Expansion (CTE) , α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	4-8 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	17-21 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel time @ 150°C	25-50 Sec

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

110 °C

Additional Information

OPTOLINQ TMC-2100IR Additional Technical Specifications

Property	Value	Unit
Transmittance at 400nm	>85	%
Preheat Temperature	75-95	℃
Molding Temperature	150-160	℃
Molding Pressure	3-8	MPa
Post Cure Time @150℃	4	hours

OPTOLINQ TMC-2100 | Optically Clear Molding Compound

TMC-2100 is developed to exhibit robust optical performance, TMC-2100IR a high IR transparent version designed for applications operating above the visible light spectrum.

OPTOLINQ TMC-2100IR | Optically Clear Molding Compound

TMC-2100IR boasts its blended chemistry system to improve IR transparency through refractive index matching and IR-transparent fillers. The transmittance shown is measured at 2 mm thick sample and will exhibit higher transmittance at a thinner samples and packages.

Inspected specimens are 1 mm thick sample cured in mold for 4 minutes at 150°C and post cured for 4 hours at 150°C.

Inspected specimens are 2 mm thick sample cured in mold for 4 minutes at 150°C and post cured for 4 hours at 150°C.

Directions Before Use

Thaw TMC-2100IR to room temperature (20±5℃, 40±15%RH) at least 24 hours before use. Do not open the bag to avoid moisture contamination.
Slowly preheat the molding compound using standard RF equipment.