RCS 550 | Rubber Cleaning Sheets

Harmonization Code : 4005.91.00.00 |   Compounded rubber, unvulcanized, in primary forms or in plates, sheets or strip: Plates, sheets, and strip
Main features
  • Low torque, suitable for intricate cavities and air vents
  • No mold abrasion & corrosion
  • Minimal odor

Product Description

CHEMLINQ RCS 550 rubber cleaning sheets are formulated to effectively remove EMC-related contaminants from mold surfaces. Specifically designed for the semiconductor industry, these sheets are ideal for cleaning molds used in the production of ICs, diodes, transistors, and LEDs. During the molding and curing process, CHEMLINQ RCS 550 applies high pressure and conforms well to the mold surface. Its excellent flow characteristics and cleaning efficiency allow it to reach and clean mold corners, thin gate areas, air vents, and other intricate mold features. CHEMLINQ RCS 550 also fills complex shapes and micro-sized mold cavities without incomplete fill issues. It does not require lead frames nor preheating during mold cleaning, further streamlining the cleaning process. Contact us for custom product dimensions.

Product Key Features

  • Minimal Odor and Fumes: formulated for more comfortable and safer working environment with significantly reduced smell and fumes during and after the cleaning process.
  • Exceptional Flow Characteristics: RCS 550 boasts excellent flow, allowing it to reach and effectively clean even the most challenging mold geometries, including tight corners and thin gate areas.
  • Elimination of Incomplete Fills: ensures consistent and high-quality production.
  • Gentle Yet Effective Cleaning: cleans without causing abrasion or corrosion to your valuable molds, extending their lifespan and maintaining their integrity.
  • Comprehensive Cleaning Power: Unlike traditional melamine cleaners, RCS 550 is also effective in cleaning air ventilation areas.

 

Product Family
RCS550  
15 mm
5
230 mm

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Appearance
Appearance
Appearance at room temperature.
 White
Compression Pressure 3-15 Kg/cm2
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 1.02-1.12
Curing Conditions
Curing Schedule
Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Cure Temperature 160-190 °C
Curing Time @ 175°C / 347°F 300-500 s

Additional Information

Selecting between RCS 550 & 560

Property CHEMLINQ RCS 550 CHEMLINQ RCS 560
Torque Lower
Minimum: 0.6 ~ 0.8 N•m 
Maximum: 4.8 ~ 5.2 N•m		 Higher
Minimum: 1 ~ 1.24 N•m
Maximum: 9.6 ~ 10.6 N•m
Applications Molds with more intricate shapes where there is a substantial amount of residue build up. RCS 550 is a genlter rubber cleaning sheet. Molds that require more thorough cleaning and can withstand higher mechanical force during the molding process. RCS 560 cleans more aggressively.

Directions for Use 

  1.  Load the rubber cleaner on to mold surface following the standard operational procedure.
  2. Add more RCS 550 if lack of rubber flow is observed within the mold cavities.
  3. Apply pressure to the rubber cleaner and adjust the cure time depending on the semiconductor mold settings.
  4. Mold temperature
    1. ~165 ℃: ~420 sec cure time
    2. ~175 ℃: ~300 sec cure time
  5. Adjustments:
    1. Higher temperature → lower cure time
    2. Lower temperature → higher cure time
  6. After cleaning, unload rubber sheets and inspect the condition of the mold press.
  7. Repeat the cleaning process 3-5 times as necessary to ensure thorough clean of mold press.