SAC387 | Pb-free Solder Spheres

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Profound Materials was founded in 2000 to manufacture and market tin-lead solder spheres for the microelectronics industry. The company has expanded to occupy a 2,100m2 (22,600 sq.ft.) facility in Kaohsiung, Taiwan where it now manufactures the widest range of solder ball offering with the tightest diameter tolerance to its customers. Early in 2006, Profound Materials achieved its TS 16949:2002 certification and now develops and manufactures its own line of low alpha ball and electro-plating solder spheres.

• Typical applications and uses include
  • Ball-attach applications of ball grid array (BGA) components
  • Ball-attach applications of Chip Scale Package (CSP) components
  • Ball-attach applications for Flip Chip (FC) components
  • BGA solder sphere rework
  • CSP solder sphere rework
• Solder Temperature & Diameter Tolerances

  • Solder Temperature and Diameter Tolerance Specification

    Tin/Lead Eutectic Solder Temperature
    Tin/Lead	錫	鉛	銀	Melting Point (℃)
    	(Sn)	(Pd)	(Ag)	Eutectic	Solidus	Liquidus
    SnA3	10	90	--	--	275	302
    SnB1	62	36	2	179	--	--
    SnA1	63	37	--	183	--	--
    Leadfree (Pb-free) Solder Temperature
    Lead-free	錫	銀	銅	Melting Point (°C)
    	(Sn)	(Ag)	(Cu)	Eutectic	Solidus	Liquidus
    SAC350	96.5	3.5	--	221	--	--
    SAC105	98.5	1	0.5	--	220	225
    SAC125	98.3	1.2	0.5	--	220	225
    SAC305	96.5	3	0.5	--	217	219
    SAC387	95.5	3.8	0.7	--	217	219
    SAC405	95.5	4	0.5	--	217	219
    Diameter Tolerance & Spheroid Tolerance :
    Diameter	Diameter Tolerance			Spheroid Tolerance		Qty/bottle
    0.76 mm	±0.015 mm			1.5%		250KPCS/bottle
    0.65 mm	±0.015 mm			1.5%		250KPCS/bottle
    0.60 mm	±0.010 mm			1.5%		250KPCS/bottle
    0.50 mm	±0.010 mm			1.5%		250KPCS/bottle
    0.45 mm	±0.010 mm			1.5%		250KPCS/bottle
    0.40 mm	±0.010 mm			1.5%		250KPCS/bottle
    0.35 mm	±0.010 mm			1.5%		250KPCS/bottle
    0.30 mm	±0.010 mm			1.5%		250KPCS/bottle
    0.25 mm	±0.010 mm			1.5%		250KPCS/bottle
    0.20 mm	±0.010 mm			1.5%		250KPCS/bottle
    0.15 mm	±0.005 mm			1.5%		1000KPCS/bottle
    0.10 mm	±0.005 mm			1.5%		1000KPCS/bottle

• Technical Specifications

  • METAL LOADING
    Tin (Sn)	: 95.5%
    Silver (Ag)	: 3.8%
    Copper (Cu)	: 0.7%
    Melting Temperature (Solidus)	: 217°C
    Melting Temperature (Liquidus)	: 219°C
    Spheroid Tolerance	: Within 1.5%
    DIAMETER TOLERANCE
    0.075mm - 0.15mm (3-6 mils)	: ±0.005mm (±0.2 mils)
    0.20mm - 0.60mm (8-24 mils)	: ±0.010mm (±0.4 mils)
    0.65mm - 0.76mm (25-30 mils)	: ±0.015mm (±0.6 mils)
    QUANTITY PER BOTTLE
    0.075mm - 0.45mm (3-18 mils)	: 1 million pieces (1,000 kpcs)
    0.50mm (20 mils)	: 500,000 pieces (500 kpcs)
    0.60mm - 0.76mm (24-30 mils)	: 250,000 pieces (250 kpcs)

• Technical Datasheets

  • TDS (English)	PMTC Sn63Pb37 Eutectic Tin/Lead Solder Spheres
    TDS (English)	PMTC SAC305 Pb-free Solder Spheres
    TDS (English)	PMTC SAC405 Pb-free Solder Spheres