Product Description
LINQALLOY SAC387 Solder Spheres are Pb-free Tin/Silver/Copper Sn95.5Ag3.8Cu0.7 Industry standard solder spheres for BGA and CSP components used by companies who have made the transition to Lead-free (Pb-free) soldering.
Furthermore, each jar has a clear label on the lid specifying the solder ball diameter as well as a label on the front identifying the alloy type, the quantity of spheres in the jar, the date of manufacture, and the product lot (or batch) number. This batch number is also tied to a certificate of conformance that is also provided with the solder spheres and ensures the SAC387 solder spheres meet the following quality criteria:
- Tin (Sn): 95.5%
- Silver (Ag): 5%
- Copper (Cu): 0.5%
- Melting Temperature (Solidus): 217°C
- Melting Temperature (Liquidus): 219°C
- Spheroid Tolerance : Within 1.5%
Diameter Tolerance
- 0.075mm - 0.15mm (3-6 mils) : ±0.005mm (±0.2 mils)
- 0.20mm - 0.60mm (8-24 mils) : ±0.010mm (±0.4 mils)
- 0.65mm - 0.76mm (25-30 mils) : ±0.015mm (±0.6 mils)
