SACQ | Pb-free Solder Spheres

Harmonization Code : 8001.20 |   Unwrought tin: Tin alloys
Main features
  • Leadfree Solder Spheres
  • Excellent Solder Joint Reliability for small devices
  • Excellent fatigue resistance

Product Description

LINQALLOY SACQ solder spheres are lead free Tin/Silver/Copper/Bismuth/Nickel alloys that contain 92.45% Tin (Sn), 4% Silver (Ag),0.5% Copper (Cu), 3% Bismuth (Bi), and 0.05% Nickel (Ni).

LINQALLOY SACQ solder spheres offer higher reliability than SAC405, in small, and thin devices, particularly in WLCSP and WLFO designs.

Features:

  • Excellent Fatigue Resistance
  • Compatible with all Flux Types
  • Excellent Solder Joint Reliability
  • Best Wetting Sn/Ag/Cu/Bi/Ni Alloy
Product Family
SACQ  
0.300 mm
250 kpcs/jar

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Alloy Composition
Alloy Composition
Composition of the alloy material
 Sn92.45Ag4Cu0.5Bi3.0Ni0.05
Alloy Type
Alloy Type
A metallic element type
 SACQ
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 7.56g/cc
Metal Loading
Bismuth (Bi)
Bismuth (Bi)
Bismuth is a chemical element with symbol Bi and atomic number 83. Bismuth is the most naturally diamagnetic element, and has one of the lowest values of thermal conductivity among metals.
 3.0 %
Copper (Cu)
Copper (Cu)
Copper is a soft malleable and ductile metal with a very high thermal and electrical conductivity.
 0.5 %
Silver (Ag) 4.0 %
Tin (Sn) 92.45 %
Thermal Properties
Melting Temperature
Liquidus Melting Temperature
Liquidus Melting Temperature
Liquidus, is the temperature point at which an alloy becomes completely liquid.
 216 °C
Solidus Melting Temperature
Solidus Melting Temperature
Solidus is the temperature point at which a completely solid alloy starts melting and becoming softer.
 211 °C
Other Properties
RoHS Compliant
RoHS Compliant
RoHS is a product level compliance based on a European Union Directive which restricts the Use of certain Hazardous Substances in Electrical and Electronic Equipment (RoHS).

Products compliant with this directive do not exceed the allowable amounts of the following restricted materials: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), with some limited exemptions
 Yes

Additional Information

How are SACQ solder spheres packed?

Each jar has a clear label on the lid specifying the solder ball diameter as well as a label on the front identifying the alloy type, the quantity of spheres in the jar, the date of manufacture, and the product lot (or batch) number. This batch number is also tied to a certificate of conformance that is also provided with the solder spheres and ensures the SAC405 solder spheres meet the following quality criteria:

  • Tin (Sn): 92.45%
  • Silver (Ag): 4%
  • Copper (Cu): 0.5%
  • Bismuth (Bi): 3%
  • Nickel (Ni): 0.05%
  • Melting Temperature (Solidus): 211°C
  • Melting Temperature (Liquidus): 216°C
  • Spheroid Tolerance: Within 1.5%