Light Emitting Diodes

Lightning, Biological and Indicators

Transceivers, Receivers, Emitters

IR Sensors General Lighting Emitters Transceivers Optocoupler

Transceivers

Fiber optic components are used to form the fiber optic networking system. Because the fiber system is much more complicated than the former copper wired system, components needed for a fiber-optic network also are sophisticated, they include but are not limited to industrial transceivers, transmitters, optical fiber, and receivers. They are designed to operate in environments requiring reliable data transmission.

Industrial fiber optic cables are becoming ever more present as they allow for operation in extremely low temperatures, mechanically abusive installations, and highly caustic and acidic environments. However, when considering fiber optic cables for the industrial environment, how the fiber optic cable is terminated, is a key factor in addition to the resistance to temperatures, abrasion, UV, and lubricants. In this situation, industrial connectors are playing an indispensable role due to their water, dust, and corrosion resistance. (Source)

Application Requirements

Key Application Requirements:

High initial transmission @ 680nm
Retention of transmission is less important as the signal can be boosted
MSL data is critical
Trade-offs of transmission for higher MSL data is possible
-40°C ~85°C operation temperature
Device MAY or MAY NOT be MAP-molded

Key Material Requirements:

Clear, high transmission, specifically @ 680nm
Low moisture absorption
Possibly filled for lower CTE for better MSL performance
High hot hardness to be removed properly from molds
High adhesion to lead frames (Ag, NiPdAu & Cu)
If MAP-molded, low CTE is required

Pluggable Transceiver Modules

Pluggable optical transceivers are compact, modular devices used to transmit and receive optical signals in high-speed communication networks. They play a crucial role in data centers, telecom networks, and optical fiber communications by converting electrical signals into optical signals for efficient data transmission.
With form factors like SFP, QSFP, and CFP, these transceivers support various transmission speeds and distances, leveraging technologies such as Wavelength Division Multiplexing (WDM) and Silicon Photonics. Their reliability depends on factors like thermal management and signal integrity, ensuring stable performance over time.

Form Factors: SFP, SFP+, QSFP, QSFP-DD, CFP, CFP2, CFP4
Applications: Data Centers, Telecom Networks, Optical Fiber Communications
Key Technologies: Wavelength Division Multiplexing (WDM), Coherent Optical Transmission, Silicon Photonics
Reliability Considerations: Thermal Management, Signal Integrity, Aging Effects
Performance Metrics: Transmission Speed, Power Consumption, Distance Coverage

Fiber Optic Transceiver Modules

Fiber optic transceiver modules are the backbone of high-speed data communication, enabling fast and reliable optical signal transmission in data centers and telecom networks. These compact modules integrate key optoelectronic components including the transmitter (TOSA), receiver (ROSA), and DSP within limited board space.

As bandwidth demands rise and laser output increases 3–5 times, effective thermal management becomes crucial to avoid signal degradation and maintain long-term performance. Thermal Interface Materials (TIMs) such as gap pads and gap fillers are essential to dissipate heat from densely packed sources while meeting strict design constraints like finer pitches, low outgassing, and automation compatibility.

Thermal Management: Transceiver Modules

Thermal Challenges:

Greater bandwidth
Higher Density
Compact Space Design (TOSA)
Finer Pitches
Increased Laser Power

Thermal Interface Material Requirements for Fiber Optic Transceiver Modules

High Thermal Conductivity
Low Oil Bleed
Low Outgassing
Process Automation
High Reliability
Thinner Bond Line
Increased Product Life Cycle

Silicon-Free pads have been tested in various optical transciever device resulting in several degrees reduced temperatures

Products for Transceivers

TC-8020 series is a high transmission, one component, optically clear epoxy molding compound that is specifically developed for sensor application and low-power LED encapsulation. Its excellent fluidity design helps it to become easily moldable and processable while offering excellent package performance and durability. This is supported by its long-term transmittance and post reflow reliability. We also provide various versions for TC-8020 to suit different application requirements.

PROPERTY	Units	XX-330HQ	TC-8020T	TC-8020L	TC-8020LS	TC-8020T-SR
			Standard	Low Stress Versions		Self-Release
Viscosity	Pa.s	400	300	300	200	300
Spiral Flow @ 150°C	inches	45	40	48	48	40
Hot Plate Gel Time @ 150°C	sec	29	40	32	32	27
Glass Transition Temperature	°C	125	125	115	100	125
CTE by TMA, Alpha1 CTE by TMA, Alpha2	ppm/°C	71 180	70 170	70 170	70 220	70 170
Moisture absorption PCT 24 hr @ 25°C in water	wt%	-	0.17	0.16	0.17	0.17
2atm100%RH24hr@121°C	wt%	2.9	3.2	3.2	3.8	3.2
Flexural Strength @25°C Flexural Modulus @25°C	MPa MPa	130 2960	135 3050	135 3000	130 2950	135 3050
200°C * 4 hr, yellowing ∆b	-	25	5	8	25	5
280°C * 30 min, yellowing ∆b		49	33	42	45	37
UV * 4 hr, yellowing ∆b		26.5	11	16.5	16.5	11
Transmittance @450nm,1mm	%		>90	>90	>90	>90
Refractive Index @633nm	-	1.52	1.56	1.56	1.56	1.56
Comment		STD Item	STD Item for through-hole and surface mount component MSL3	Low stress For better reflow performance MSL3	Even lower stress for better reflow and thermal shock test performance MSL3	Self-release technology without compromising vital properties