TC-8020T | Optically Clear Molding Compound

Harmonization Code : 3907.30.00.15 | Epoxide resin, halogen-free

TC-8020T | Optically Clear Molding Compound

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TC-8020T | Clear Epoxy Molding Compound for Through Hole MSL4 SMT devices

Main features

LED Encapsulation
Optically clear
Emitter and Detector encapsulation

Product Description

TC-8020T is a high transmission, one component, optically clear epoxy molding compound that is specifically developed for emitter and LED encapsulation. Its excellent fluidity design aids it to become easily mouldable and processable while offering excellent package performance and durability. This is supported by its long term transmittance and post reflow reliability.

TC-8020T is a single component epoxy with superior adhesion performance, transmittance and stability at high temperatures. It is mainly utilised to package single color (monochrome) LEDs, 7-segment LED displays, compact LED indicators, monochrome ChipLEDs and photo-links.It offers good adhesion to Bismaleimide Triazine - BT substrates and metal leadframes, good flexural modulus, and excellent anti-reflow performance while also passing the stringent MSL 3/2A JEDEC requirements. Check TC-8020T Internal Reliability Test Results.

Typical Applications

Low-Power LED & Emitters
Pulse Oximeter Sensors
Ambient Light Sensors
IR and Near-IR Sensors
Data transmission and industrial fibers.

Versions Available

Low-stress versions TC-8020L/LS (DMA modulus comparison)
Self-release version TC-8020T-SR (Series property comparison)
Optical filter versions TC-8020T-IR800/840 (Transmittance curve)

Comparable With: XX-18, XX-8524, XX-330H

Product Family
TC8020T

1. Select Package Type

10Kg Box 7Kg Box

2. Available Transmittance

450 nm 800 nm 840 nm

3. Available Pellet Size

13 mm 16 mm 14 mm 35 mm

4. Available Pellet Weight

2.9 gr 2.5 gr 3.2 gr 25 gr 22.5 gr 3.8 gr

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Refractive index

Refractive index
The refractive index determines how much the path of light is bent, or refracted, when entering a material. It is calculated by taking into account the velocity of light in vacuum compared to the velocity of light in the material.

The refractive index calculation can be affected by the wavelength of light and the temperature of the material. Even though it is usually reported on standard wavelengths it is advised to check the TDS for the precise test parameters.

1.56

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.23

Physical Properties

Spiral Flow @ 175°C

150 - 250 cm

Chemical Properties

Mechanical Properties

Hardness Hardness Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Durometer (Shore A)	75
Durometer (Shore D)	86

Molded Shrinkage

1.6 %

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	70 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	170 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 160°C / 320°F	20 - 40 sec

Curing Conditions

Curing Schedule Curing Schedule Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV. Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure. There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure. Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Cure Time	3 - 5 min
Mold Temperature	140 - 160 °C
Preheat Temperature	40 - 80 °C

Post Mold Cure
Post Mold Cure @ 150°C / 302°F	4 - 6 hrs

Additional Information

TC-8020 Series Products Properties Comparison

PROPERTY	UNIT	TC-8020T	TC-8020L	TC-8020LS	TC-8020T-SR
Viscosity	Pa.S	300	300	200	300
Spiral Flow @150°C	inches	40	48	48	40
Hot Plate Gel Time @150°C	sec	40	32	32	27
Glass Transition Temperature	°C	125	115	100	125
CTE by TMA, α1 CTE by TMA, α2	ppm ppm	70 170	70 170	70 220	70 170
Moisture Absorption PCT 24 hrs @25°C water 24 hrs @121°C, 2atm, 100%RH	wt% wt%	0.17 3.2	0.16 3.2	0.17 3.8	0.17 3.2
Flexural Strength @25°C Flexural Modulus @25°C	MPa Mpa	135 3050	135 3000	130 2950	135 3050
yellowing Δb - 4 hrs @200°C yellowing Δb - 30 min @280°C yellowing Δb - 4 hrs UV	-	5 33 11	8 42 16.5	25 45 16.5	5 37 11
Transmittance 1mm @450nm	%	>90	>90	>90	>90
Refractive Index @633nm	-	1.56	1.56	1.56	1.56
Comment		Standard Item for through-hole and surface mount component	Low stress version for better reflow performance	Even lower stress for better reflow and thermal shock test performance	Self-release technology without compromising key properties

TC-8020T DSC & DMA Data

TC-8020L/LS shows lower modulus at 150℃ and -50℃, which improves performance in thermal cycling and thermal shock tests.

TC-8020T DSC Data Curve

TC-8020T DMA Data Curve

TC-8020T Optical Filter Choice

Transmittance wavelength window could be adjusted according to customers' specifications.

TC-8020 Cutoff Filter Versions Transmittance Data

Transmittance Curve: TC-8020T Cutoff Filter 1mm

Transmittance Curve: TC-8020T Bandpass Filter 0.4mm

TC-8020T Reliability Test Results

Tests	Test Conditions	Electrical Test	Yellowing
High Temperature Storage	200°C * 4 hr	Pass	Δb < 4.5
UV Exposure	25w * 1 hr @340nm	Pass	Δb < 12.0
Reflow	10 x 30 sec @ 260°C, IR reflow	Pass	Δb < 35.0
Reflow	3 x 30 sec @ 260°C, IR reflow after 6 hrs' storage @85 °C and 85% RH	Pass	-
Thermal Shock	15 mins@-40°C ~ 15mins@100°C, 300 cycles	Pass	-
Red Dye Penetration	PCT, 12 hrs @121°C	Pass	-
Double 85	168 hrs @85°C and 85% RH	Pass	-
High Temperature Storage	125°C * 500 hrs	Pass	-
HAST	HAST 110; HAST 130	Pass	-