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TC-8020T | Optically Clear Molding Compound

Harmonization Code : 3907.30.00.15 |   Epoxide resin, halogen-free
TC-8020T | Optically Clear Molding Compound
TC-8020T | Optically Clear Molding Compound
TC-8020T | Optically Clear Molding Compound for RGB ChipLED Encapsulation
TC-8020T-IR800 | Optically Clear Molding Compound for IR and NIR Emitters and DetectorspLED Encapsulation
TC-8020T | Optically Clear Molding Compound RGB for ChipLED
TC-8020T | Optically Clear Molding Compound
TC-8020T | Optically Clear Molding Compound for RGB ChipLED Encapsulation
Main features
  • LED Encapsulation
  • Optically clear
  • Emitter and Detector encapsulation

Product Description

TC-8020T is a high transmission, one component, optically clear epoxy molding compound that is specifically developed for emitter and LED encapsulation. Its excellent fluidity design aids it to become easily mouldable and processable while offering excellent package performance and durability. This is supported by its long term transmittance and post reflow reliability.

TC-8020T is a single component epoxy with superior adhesion performance, transmittance and stability at high temperatures. It is mainly utilised to package single color (monochrome) LEDs, 7-segment LED displays, compact LED indicators, monochrome ChipLEDs and photo-links.It offers good adhesion to Bismaleimide Triazine - BT substrates and metal leadframes, good flexural modulus, and excellent anti-reflow performance while also passing the stringent MSL 3/2A JEDEC requirements.

TC-8020T comes in three versions.

  1. Standard - Transmittance over 450nm.
  2. IR800 - Absorption between 340 - 700nm. Transmittance over 800nm (scales between 700-800)
  3. IR840 - Absorption between 340 - 840nm. Transmittance over 840nm
Product Family
TC8020T  
10Kg Box 7Kg Box
450 nm 800 nm 840 nm
13 mm 16 mm 14 mm 35 mm
2.9 gr 2.5 gr 3.2 gr 25 gr 22.5 gr 3.8 gr

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
In stock In stock
Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Refractive index
Refractive index
The refractive index determines how much the path of light is bent, or refracted, when entering a material. It is calculated by taking into account the velocity of light in vacuum compared to the velocity of light in the material.

The refractive index calculation can be affected by the wavelength of light and the temperature of the material. Even though it is usually reported on standard wavelengths it is advised to check the TDS for the precise test parameters.
 1.56
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 1.23
Chemical Properties
Moisture Absorption
Moisture Absorption
Moisture absorption shows the capacity of a polymer to absorb moisture from its environment.

Absorbed moisture can reduce the glass transition temperature and strength of a polymer and can also result in popcorning, unreliable adhesion or voids in the bond line due to moisture desorption or entrapment.

Moisture absorption should always be mentioned with the test conditions to provide a meaningful frame of reference.
Moisture absorption 0.45 %
Water Absorption 0.17 %
Mechanical Properties
Hardness
Hardness
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Durometer (Shore D) 86
Molded Shrinkage 1.6 %
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 70 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 170 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 160°C / 320°F 20 - 40 sec
Spiral Flow
Spiral Flow @ 175°C 150 - 250 cm
Curing Conditions
Curing Schedule
Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Cure Time 3 - 5 min
Mold Temperature 140 - 160 °C
Preheat Temperature 40 - 80 °C
Transfer Pressure 10 - 40 kg/cm2
Transfer Time 20 - 50 s
Post Mold Cure
Post Mold Cure @ 150°C / 302°F 4 - 6 hrs

Additional Information

 

IR840 Transmittance chart

 

IR800 Transmittance chart

 

Adhesion force on Cu | TC-8020T-450 vs Competitor