OPTOLINQ TMC-8060 | Clear Optical Molding Compound

Harmonization Code : 3907.30.00.15 |   Epoxide resin, halogen-free
Main features
  • LED Encapsulation
  • Outdoor applications
  • Low blue ray decay

Product Description

OPTOLINQ TMC-8060 is a high-performance optical solid epoxy specifically developed for white decorative and backlight LED encapsulation. This monocomponent epoxy achieves superior adhesion performance and great transmittance. Its stability at high temperature aids towards a good package performance and long life. It is a low stress, heat resistant epoxy with low stress hardeners that has been designed around its warpage and moisture capabilities.

OPTOLINQ TMC-8060 is able to offer low blue-ray decay for outdoor LED applications and overall great light performance. This anti yellowing white epoxy is very close to competitive solutions such as XX814, XX1000 and XX97. 

Reliability Tests Passed:

  • Thermal cycling, -45°C ~ 100°C * 500 cycles
  • Double 85, 85°C * 85%RH * 168hrs
  • High temperature storage, 150°C * 1000hrs
  • Reflow, 260°C * 10s * 3 times

Advanced Versions For Automotive Applications:

To Know More about High Performance TMC-8060:

Product Family
TMC8060  
10Kg Box
450 nm
13 mm 14 mm 16 mm 35 mm
2.9 gr 2.5 gr 3.2 gr 25 gr

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Color
Color
The color
 Transparent
Refractive index
Refractive index
The refractive index determines how much the path of light is bent, or refracted, when entering a material. It is calculated by taking into account the velocity of light in vacuum compared to the velocity of light in the material.

The refractive index calculation can be affected by the wavelength of light and the temperature of the material. Even though it is usually reported on standard wavelengths it is advised to check the TDS for the precise test parameters.
 1.56
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 1.3
Physical Properties
Spiral Flow @ 175°C 150 - 250 cm
Chemical Properties
Water Absorption 0.25 %
Mechanical Properties
Hardness
Hardness
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Durometer (Shore D) 89
Flexural Modulus
Flexural Modulus @ 25°C 3300 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
 110 N/mm2
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE) , α1
Coefficient of Thermal Expansion (CTE) , α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 85 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 180 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 160°C / 320°F 20 - 40 sec
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 160 °C
Curing Conditions
Curing Schedule
Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Cure Time 3 - 5 min
Mold Temperature 140 - 160 °C
Preheat Temperature 40 - 80 °C
Post Mold Cure
Post Mold Cure @ 150°C / 302°F 4 - 6 hrs
Transfer Pressure 10 - 40 kg/cm2
Transfer Time 20 - 50 s

Additional Information

Competitive Analysis TMC-8060

For LED applications, it is expected to keep properties of optical encapsulants as low decay as possible. This mainly depends on chemistry systems such as resin type. However, there will always be trade-offs between those properties aiming to achieve. TMC-8060 has the best capabilities of anti-blue/UV decay and anti-yellowing at high temperatures among OPTOLINQ TMC series products for optoelectronics encapsulation. It has comparable high temperature stability with XX-1000 and XX-814. If you prefer a product with better moisture resistance aiming at passing high MSL tests, TMC-8040 is a better option and equivalent to XX-600H. 

TC-8000 Series Transmittance Data
TC-8060 vs XX1000 Transmittance Decay

 

TMC-8060 Superior Low Decay Against Heat And UV 

Advanced Versions Aimed At Automotive Applications

For  automotive applications, optoelectronics need to pass harsh thermal cycling tests (TCT). To meet higher TCT test requirements. , the CTE mismatch among various packaging materials induces high thermal-mechanical stresses resulting in package expansion and shrinkage by high and low temperatures. It will cause a failure like warpage, delamination, crack, etc. This could be improved by controlling the thermal stress and improving adhesion strength between epoxy compound and substrate.

TMC-8060-IMP product with flexible segment achieved lower modulus comparing with TMC-8060 original version, could meet higher thermal cycling test requirements. 

TMC-9000T with transparent filler technology achieves low CTE and low water absorption, comparing with TC-8060. It also remains the superior anti-blue decay properties of TMC-8060. For harsh TCT requirements and high MSL requirements, TMC-9000T is recommended. 

TC-9000T Low CTE version of TC-8060