EMC-G194 | Black Epoxy Molding Compound

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

Main features

Good moldability
Low stress
High adhesion

Product Description

LINQSOL EMC-G194 is a green epoxy molding compound engineered for use in rectifier diodes, SMX, TO, and DIP semiconductor packages. It is designed for efficient, high-volume molding operations with excellent flow and low internal stress. This makes it ideal for devices with complex shapes or rigorous process requirements. EMC-G194 has high adhesion strength on leadframes, copper, and other common substrate materials, reducing delamination risks and ensuring mechanical stability during thermal cycling and high-temperature operation.

LINQSOL EMC-G194 delivers high performance and reliability while meeting EU RoHS requirements and REACH Substances of Very High Concern (SVHC) restrictions. EMC-G194 seamlessly integrates advanced material properties, safety compliance, and superior performance for reliable semiconductor encapsulation.

Product Key Features:

Optimized Rheology for Enhanced Moldability: Allows for complete cavity fill, minimal wire sweep, and reduced void formation
Low Stress Formulation: Minimizes stress exerted on the encapsulated die and bond wires during thermal cycling, significantly reducing the risk of delamination, die cracking, and bond wire deformation.
High Adhesion for Robust Encapsulation: Crucial for preventing moisture ingress and delamination, which are primary failure mechanisms in encapsulated devices. The strong bond integrity ensures long-term protection against environmental factors and mechanical stresses.

LINQSOL EMC-G194 is available in custom pellet dimensions. Contact us for more information.

Specifications
Additional Information

Technical Specifications

General Properties

Filler Size Cut

150 µm

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.82

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	6 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	8 ppm

Water Absorption

0.44 %

Electrical Properties

Water Extract Data Water Extract Data Water Extract Data, 20hrs water boil
Conductivity	0.1 mmhos/cm

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	15000 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	140 N/mm2

Water Extract Data Water Extract Data Water Extract Data, 20hrs water boil
pH of extract	5

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE) , α1 Coefficient of Thermal Expansion (CTE) , α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	16 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	62 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	22 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

175 °C

Additional Information

Processing Instructions

Before use, let LINQSOL EMC-G194 reach room temperature (23±5 °C) for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.
Use the materials within 72 hours after removing the container from cold storage.

Storage and Handling

LINQSOL EMC-G194 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 5 °C is 183 days.