Product Description
LOCTITE ABLESTIK 3230 electrically conductive, silver filled, die attach epoxy adhesive is designed for high reliability package applications . It can be used in a variety of package sizes.
LOCTITE ABLESTIK 3230 offers low stress and excellent adhesion to copper, combined with excellent JEDEC performance.
Cure Schedule
- 30 minute ramp to 175°C + 15 minutes @ 175°C