Hysol GR17 | White Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

Main features

Reflective compound
For Optocouplers
High moldability

Product Description

Hysol GR17 is a white, reflective epoxy molding compound used for optical applications. This silica filled (68%) product has been designed to improve light reflectance and workability for optocouplers also knows as photo-couplers, optical isolators, or opto-isolators.

Hysol GR17 cures with heat and can be used for transfer processes. It has been formulated to provide high moldability, low stress and high adhesion to a variety of substrates. Transmissivity is 18.5.

Product Family
GR17

1. Select Product Form

Pellet

2. Available Pellet Size

13 mm

3. Available Pellet Weight

4.1 gr

4. Available Package Size

15 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties
Color Color The color	White
Filler Content	68 %
Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.	1.75
Chemical Properties
Moisture absorption	0.46 %
Physical Properties
Spiral Flow @ 175°C	50 cm
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg) The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.	182 °C
Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.	0.65 W/m.K
Curing Conditions
Transfer Pressure	40 - 85 kg/cm2
Transfer Time	10 - 15 s

Additional Information

Storage

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.

Optimal Storage: 5°C or below, in closed containers. After removal from cold storage, the material MUST be allowed to come to room temperature, in the sealed container, to avoid moisture contamination. The suggested waiting time for a standard 15 kg carton box is 24 hours.