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LOCTITE ABLESTIK 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. The rheology of ABLESTIK 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems.
LOCTITE ABLESTIK 84-1LMISR4 is a manufacturer's product of choice, can be used for LED applications and like most epoxies it is suitable for Copper substrates. Interested in higher conductivity? Then you might want to consider 8060T or even 8064T for larger dies.
LOCTITE ABLESTIK 84-1LMISR4 can be applied by stamping or dispensing and it should present sufficient stiffness to allow wire bonding. Its unique combination of adhesive properties makes this material one of the most widely used die attach materials in the semiconductor industry.