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LOCTITE ABLESTIK 968-2

Harmonization Code : 3506.10.00.00 |   Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
LOCTITE ABLESTIK 968-2
LOCTITE ABLESTIK 968-2
LOCTITE ABLESTIK 968-2
Main features
  • Electrically insulating
  • Hybrid chemistry
  • Dispense and Stencil print

Product Description

LOCTITE ABLESTIK 968-2 die attach adhesive is designed for microelectronic chip bonding applications. This adhesive is ideal for application by syringe dispensing or screen printing.

Cure Schedule

  • 2 hours @ 150°C

    • Product Family
    968-2  
    EFD Syringe
    3 cc 5 cc

    Catalog Product

    Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
    Not Available Shipping in 8 - 12 weeks
    Packaging
    TDS & SDS
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    Technical Specifications

    General Properties
    Curing Schedule
    Curing Schedule
    Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

    Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

    There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

    Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
    Curing Heat Cure
    Shelf Life
    Shelf Life
    Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

    It differs vastly per product and it is based on temperature and storage conditions.

    The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
    Shelf Life @ -40°C 365 days
    Work life @25°C
    Work life @25°C
    Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

    It is based on the change in viscosity and it can rely on the application requirements.
    		 96 hours
    Chemical Properties
    Extractable Ionic Content, after 20 hours
    Chloride (Cl-)
    Chloride (Cl-)
    The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
    		 215 ppm
    Sodium (Na+)
    Sodium (Na+)
    The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
    		 15 ppm
    Potassium (K+)
    Potassium (K+)
    The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
    		 30 ppm
    Mechanical Properties
    Viscosity
    Viscosity
    Viscosity is a measurement of a fluid’s resistance to flow.

    Viscosity is commonly measured in centiPoise (cP). One cP is defined as
    the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

    A product like honey would have a much higher viscosity -around 10,000 cPs-
    compared to water. As a result, honey would flow much slower out of a tipped glass than
    water would.

    The viscosity of a material can be decreased with an increase in temperature in
    order to better suit an application
    Viscosity 45,000 MPa.s
    Thermal Properties
    Glass Transition Temperature (Tg)
    Glass Transition Temperature (Tg)
    The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

    The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
    		 139 °C
    Thermal Conductivity
    Thermal Conductivity
    Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

    Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
    		 0.865 W/m.K
    Coefficient of Thermal Expansion (CTE)
    Coefficient of Thermal Expansion (CTE)
    CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

    Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
    system consists of an adhesive plus some other solid component.
    Coefficient of Thermal Expansion (CTE), α1
    Coefficient of Thermal Expansion (CTE), α1
    CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

    It explains how much a material will expand until it reaches Tg.
    		 35 ppm/°C
    Coefficient of Thermal Expansion (CTE), α2
    Coefficient of Thermal Expansion (CTE), α2
    CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

    It explains the extent to which a material will expand after it passes Tg.
    		 100 ppm/°C