Product Description
LOCTITE ABLESTIK 968-2 die attach adhesive is designed for microelectronic chip bonding applications. This adhesive is ideal for application by syringe dispensing or screen printing.
LOCTITE ABLESTIK 968-2 is an electrically insulating epoxy with a proprietary hybrid chemistry. It is successfully used in aerospace and defense applications, meets the requirements of MIL-STD-883, Method 5011 and can pass the NASA outgassing standard if properly cured.
Cure Schedule