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LOCTITE® ABLESTIK ABP 2030SCR silver filled conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes. Another interesting property is that it exhibits lower strength at higher temperatures for easier chip removal.
LOCTITE® ABLESTIK ABP 2030SCR is the improved and latest version that supersedes 2030SC and 2030SCM.