Product Description
LOCTITE® ABLESTIK ABP 2035SCR non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is a direct replacement for its predecessors LOCTITE ABLESTIK 2033SC and LOCTITE ABLESTIK 2035SC. This BMI/Acrylic material is designed to minimize stress and resulting warpage between dissimilar surfaces. This adhesive has a maximum filler size of less than 25um and an average of less than 15um. Compared to its predecessors, it also has the benefit of improved compatibility with UV encapsulants.
LOCTITE® ABLESTIK ABP 2035SCR cures in low temperatures with high adhesion and excellent dispensing performance. It is ideal for ASIC attach and Lid/Cap attach of optical sensors and as a received die attach for 3d sensing modules. This material is not expected to pass very harsh reliability requirements.
LOCTITE® ABLESTIK ABP 2035SCR has been developed without DHCP. Though it is not banned for use, DHCP has been included on the Substances of Very High Concern (SVHC) list and could eventually be restricted for supply into Europe following future REACH and ECHA regulations. As is listed on the SDS of its predecessors LOCTITE ABLESTIK 2033SC and LOCTITE ABLESTIK 2035SC, DHCP is used as part of the formulation and therefore do contain substances on the SVHC list. So though there is no defined end date for use of ABP 2033SC or ABP 2035SC, when the DCHP substance in both would change from current SVHC list to Annex XIV list, there could be a 3-4 years sunset period on these older products. The "R" in the name thus stands for "REACH future proofing".
Cure Schedule
- 2 minutes @ 120°C
- 30 minutes @ 100°C
- 60 minutes @ 80°C