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LOCTITE® ABLESTIK ABP 2035SCR non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This BMI/Acrylic material is designed to minimize stress and resulting warpage between dissimilar surfaces. This adhesive has a maximum filler size of less than 25um and an average of less than 15um.
LOCTITE® ABLESTIK ABP 2035SCR cures in low temperatures with high adhesion and excellent dispensing performance. It is ideal for ASIC attach and Lid/Cap attach of optical sensors and as a received die attach for 3d sensing modules. This material is not expected to pass very harsh reliability requirements.