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LOCTITE® ABLESTIK ABP 2035SCR non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces.
LOCTITE® ABLESTIK ABP 2035SCR has an average filler size of <15um with a maximum filler cut of less than 25um. It is the improved and latest version that supersedes 2035SC and 2033SC.