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LOCTITE ABLESTIK QMI3555R

Harmonization Code : 3506.91.90.99 |   Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
  • Wide processing window
  • Low temperature profile
  • Low stress on die

Product Description

LOCTITE ABLESTIK QMI 3555R is a low temperature processing, no dry, silver glass die attach adhesive for the attachment of integrated circuits in both solder seal and glass seal hermetic packages. It is designed for fast firing large die or small dies on either gold plated or bare ceramic substrates. The paste fires into a film that provides high thermal and electrical conductivity as well as excellent initial adhesion. It is extremely resistant to degradation during temperature cycling from -65°C to +150°C.

LOCTITE ABLESTIK QMI 3555R incorporates a patented silver/vanadium glass. Sub-350°C firing enhances the reliability of devices fabricated with sub-micron design rules. Also, in cofired package applications, nickel diffusion through gold plated seal rings and leadfinger pads are minimized at lower temperatures. QMI3555R low stress allows for a thin bondline, offering improved thermal performance for high power devices.

QMI 3555R can be fired at temperatures between 300°C and 450°C on bare ceramic. On gold plated parts, the minimum peak should be 325°C. The minimum dwell time should be at least 14 minutes above 300°C when the peak is <325°C. Higher peak temperatures require less dwell time. There should not be any rapid spikes in the ramp that would volatilize the solvents and create voids.

Product Family
QMI3555R  
2 oz jar

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Not Available Shipping in 8 - 12 weeks

Technical Specifications

General Properties
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 15°C 12 months
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
10 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
20 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
20 ppm
Mechanical Properties
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Thixotropic index
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
10
Viscosity 35,000 mPa.s
Thermal Properties
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
80 W/m.K

Additional Information

QMI 3555R can be fired at temperatures between 300°C and 450°C on bare ceramic. On gold plated parts, the minimum peak should be 325°C. The minimum dwell time should be at least 14 minutes above 300°C when the peak is <325°C. Higher peak temperatures require less dwell time. There should not be any rapid spikes in the ramp that would volatilize the solvents and create voids.

See the Technical Data Sheet for Firing profiles.