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LOCTITE ABLESTIK QMI 3555R is a low temperature processing, no dry, silver glass die attach adhesive for the attachment of integrated circuits in both solder seal and glass seal hermetic packages. It is designed for fast firing large die or small dies on either gold plated or bare ceramic substrates. The paste fires into a film that provides high thermal and electrical conductivity as well as excellent initial adhesion. It is extremely resistant to degradation during temperature cycling from -65°C to +150°C.
LOCTITE ABLESTIK QMI 3555R incorporates a patented silver/vanadium glass. Sub-350°C firing enhances the reliability of devices fabricated with sub-micron design rules. Also, in cofired package applications, nickel diffusion through gold plated seal rings and leadfinger pads are minimized at lower temperatures. QMI3555R low stress allows for a thin bondline, offering improved thermal performance for high power devices.
QMI 3555R can be fired at temperatures between 300°C and 450°C on bare ceramic. On gold plated parts, the minimum peak should be 325°C. The minimum dwell time should be at least 14 minutes above 300°C when the peak is <325°C. Higher peak temperatures require less dwell time. There should not be any rapid spikes in the ramp that would volatilize the solvents and create voids.
See the Technical Data Sheet for Firing profiles.