Only signed in users will see discount codes and have complete access to product lines, datasheets and pricelists
LOCTITE ECCOBOND UF 3820 reworkable underfill is specially designed for CSP, WLCSP and BGA applications. It is formulated to cure quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.
LOCTITE ECCOBOND UF 3820 is a high TG, easy to rework epoxy that cures fast at moderate temperatures. It is capable of flowing at room temperature and offer high fracture toughness and excellent thermal cycle performance.
Why do we need a reworkable underfill?
It is desirable to have a material that is re-workable:
This way we can avoid damage that can occur by:
The rework process is fairly straightforward. We need to locally go above the reflow temperature of the solder and then mechanically remove the component