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MH20-2000 Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • Black epoxy mold compound
  • Transfer molding
  • Class B (130°C)

Product Description

High temperature resistant epoxy mold compound designed for encapsulation of automotive copper parts tested to AEC-Q200 specification

MH20-2000 is a very tough epoxy mold compound with excellent high temperature resistance. It is designed for automotive applications that require thermoset epoxies instead of thermoplastics to meet higher performance requirements and AEC-Q200 specification.

MH20-2000 is used on devices that have operating temperature above 200°C. It is CTE matched to copper, CuSn6 and bronze.

MH20-2000 works equally well on tin-plated copper applications. Adhesion to these substrates has been tested extensively.

Main Applications

  • Thermal Fuses
  • Tin-plated Copper parts
  • Smaller parts designed to meet automotive requirements

Product Features & Benefits:

  • Very tough epoxy mold compound
  • High Tg compound designed for higher temperature applications
  • Used on devices with an operating temperature up to 200°C
  • Designed for excellent adhesion and CTE-matched to copper, CuSn6 and bronze.

Used on underhood automotive and other high temperature applications requiring a high glass transition temperature and great thermal cycle resistance from -55°C to 125°C.

Read More
Product Family
MH0694  
Pellet
14.3MM x 5.3G mm

Catalog Product

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Technical Specifications

General Properties
Process Method Transfer Molding
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.83
Color
Color
The color
Black
Filler Content 80 %
Shelf Life
Shelf Life @ 5°C 365 days
Chemical Properties
Extractable Ionic Content, after 20 hours
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
20 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
20 ppm
Mechanical Properties
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
157 N/mm2
Hardness
Hardness
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C / 347°F after 90 seconds 90
Flexural Modulus
Flexural Modulus @ 25°C 16800 N/mm2
Molded Shrinkage 0.24 %
Electrical Properties
UL Rating Class B (130°C)
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
440000000000000000 Ohms⋅cm
Thermal Properties
Gel Time
Gel Time @ 175°C / 347°F 23 s
Spiral Flow
Spiral Flow @ 175°C / 347°F 86 cm
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
175 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.5 W/m.K
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.
15 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.
45 ppm/°C
UL94 Rating
UL94 @ 1/4 inch V0
Other Properties
RoHS Compliant
RoHS Compliant
RoHS (Restriction of Hazardous Substances) restricts teh use of specific hazardous materials found in the electrical and reflectivity of any metal.
Yes
Curing Conditions
Preheat Temperature 80 - 95 °C
Molding Temperature 140 - 180 °C
Transfer Pressure 40 - 85 kg/cm2
Transfer Time 6 - 15 s
Curing Time
Curing Time @ 175°C / 347°F 70 - 90 s
Curing Time @ 175°C / 347°F (Automold) 50 - 70 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 2 - 6 hrs

Additional Information

Pricing & Availability

Pricing for {product_seo_name}

Pricing and Volume Price Breaks for MH20-2000 Black Epoxy Mold Compound are available by contacting us. You cannot order this product directly online.

CAPLINQ lists all its prices without taxes, shipping payment charges or discounts. CAPLINQ has warehouses and ships from both Canada and the Netherlands, and if your shipping address is one of these two countries, applicable taxes will be applied.

If your shipping address is to the United States, we request your company’s Employer Identification Number (EIN) or Tax Identification Number (TIN). This is a unique 9-digit number assigned by the IRS and is required for all cross-border shipments. Failure to provide this number could result in delays to your order.

If your shipping address is within the EU, but outside the Netherlands, then we are required to request your company's Value Added Tax (VAT, BTW, MwSt) number to be able to ship the goods tax-free. For all other countries, no taxes are levied on your orders.

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Minimum Order Quantity for MH20-2000 Black Epoxy Mold Compound

The minimum order quantity for this package size is (s).


Shipping Charges for MH20-2000 Black Epoxy Mold Compound

All prices shown are ex-works CAPLINQ, but during the checkout process, you will be given several shipping options including Canada Post, TNT, UPS or the choice of using your own freight forwarder. Depending on your shipping address, the shipping charges will be calculated as follows:

  • Europe, Middle East, Asia and Africa: Shipping from CAPLINQ Europe BV (Amsterdam, the Netherlands)
  • Canada, USA, Mexico and South America: Shipping from CAPLINQ Corporation (Ottawa, Canada)


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During the checkout process, you will be presented with several payment options including:

  • Credit Card (We accept VISA and Mastercard)
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Availability for MH20-2000 Black Epoxy Mold Compound

To the right of the product is a small icon that lets you know the availability and leadtime of the product. This leadtime is the time to ship the product and delivery times vary based on the method of delivery you select at the time you place your order.

Contact us if anything is unclear or you need more assistance.

Technical Specifications

Short Description of MH20-2000 Black Epoxy Mold Compound

Typical applications and uses of MH20-2000 Black Epoxy Mold Compound include:

  • Electrical Insulation
  • Motor Irons
  • Bus Bars

Technical Datasheets for MH20-2000 Black Epoxy Mold Compound

TDS (English) Kapton_Technical_Data_Sheet Click to access MH20-2000 Black Epoxy Mold Compound Technical Data Sheet
*Note that only registered users may access technical datasheets

Competitive Crossovers

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Names
Product
Description
CAPLINQ
Part#
  • Pelnox PCE-282

High temperature resistant epoxy mold compound designed for encapsulation of automotive copper parts tested to AEC-Q200 specification

MH20-2000 is a very tough epoxy mold compound with excellent high temperature resistance. It is designed for automotive applications that require thermoset epoxies instead of thermoplastics to meet higher performance requirements and AEC-Q200 specification.

MH20-2000 is used on devices that have operating temperature above 200°C. It is CTE matched to copper, CuSn6 and bronze.

MH20-2000 works equally well on tin-plated copper applications. Adhesion to these substrates has been tested extensively.

Main Applications

  • Thermal Fuses
  • Tin-plated Copper parts
  • Smaller parts designed to meet automotive requirements

Product Features & Benefits:

  • Very tough epoxy mold compound
  • High Tg compound designed for higher temperature applications
  • Used on devices with an operating temperature up to 200°C
  • Designed for excellent adhesion and CTE-matched to copper, CuSn6 and bronze.

Used on underhood automotive and other high temperature applications requiring a high glass transition temperature and great thermal cycle resistance from -55°C to 125°C.


  • MH20-2000 Black Epoxy Mold Compound
 

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Additional Information

Additional Information about MH20-2000 Black Epoxy Mold Compound
  • Harmonization Code
    • Customs Harmonization Code (HTS#) for MH20-2000 Black Epoxy Mold Compound
      3907.30.00.90 |  
  • Additional Information

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Packaging Details

Packaging Details for MH20-2000 Black Epoxy Mold Compound

The following information is specifically related to each unit of measure of MH20-2000 Black Epoxy Mold Compound. If you which to compare this to other product sizes, click on the respective product from the list above and check here for values specific to that product. These values are taken from our internal database and are used in the calculation of the gross weight and packaging dimensions of the goods during shipping. You can use these values to to approximate delivery charges using your own carrier.

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