Specialty Chemicals, Adhesives & Plastics
Only signed in users will see discount codes and have complete access to product lines, datasheets and pricelists
CAPLINQ's Chemlinq MRE-C909 Mold Release is a carnauba wax based, sprayable aerosol mold release agent. It contains no silicones or oils and is therefore not only compatible but complementary to epoxy molding compound and other thermoset plastic molding.
Alternative to MJGordon Permasil #909C
Chemlinq MRE-C909 is a fully REACH and RoHS compliant carnauba wax mold release aerosol spray and does not contain trichloroethane (CAS: 71-55-6) or dichloromethane (CAS: 75-09-02). It is designed for mold release of epoxy molding compounds and was specifically formulated as an alternative to MJ Gordon Permasil #909C after MJ Gordon discontinued the production of this product. MRE-C909 is literally the 9th iteration, and serves as a reminder of the 8 previous unsuccessful formulation attempts before finally formulating MRE-C909.
In order to have the best results during the production process, a thin, uniform thickness of MRE-C909 should be sprayed on the mold. The release agent has no build-up on the mold and should show a shiny surface when properly applied.
Instructions for use:
Carnauba wax itself is nothing new. It is a natural wax derived from the a palm tree native to the northeastern Brazil. It is used in a wide variety of applications including automotive waxes, shoe polishes, dental floss coatings, and paper coatings. More importantly, it is used in the production of epoxy molding compounds themselves as the mold release agent.
Carnauba wax is the same natural mold release wax used in the manufacture of semiconductor epoxy molding compounds
There is no silicone, Teflon or oil in the MRE-C909 formulation. While Teflon and silicone may be well-suited for the release of rubber molds or to coat anti-stick surfaces, they rarely have a place when working liquid epoxy, epoxy molding compounds (EMC) and other thermoset plastic types. Most semiconductor manufacturers know this of course, and use chunks of carnauba wax to break in new epoxy molds or to release the plunger when it sticks. Carnauba wax is compatible with epoxies and generally enhances its properties along with those of most other engineering plastics.
Chemlinq MRE-C909 does not contain any chlorofluorocarbon and ozone-depleting substances. It also does not contain trichloroethane CAS No: 71-55-6 or dichloromethane CAS No: 75-09-2, making the solvent and propellant used physiologically safe as well as both REACH and RoHS compliant.
Chemlinq MRE-C909 is a non-silicone mold release agent developed specifically for both transfer molding and compression molding where thermoset plastics such as epoxies, phenolics, and melamines are used. MRE-C909 is suitable for epoxy mold compound applications which require only a thin, uniform layer of mold release for best results. Due to its dryness, MRE-C909 provides the perfect balance of release and rustproofing for the mold without leaving a greasy layer on the molded part after molding.
Chemlinq MRE-C909 is a proven alternative to MJ Gordon #909C. CAPLINQ worked very hard developing a carnauba wax based mold release spray that, unlike MJ Gordon’s #909C, is fully REACH and RoHS compliant. With final phase of REACH being introduced in 2018, it was imperative that our European clients found and qualified a carnauba was mold release spray that they could use after REACH was fully implemented.
Just like MJ Gordon’s #909C it’s an aerosolized solution of carnauba wax suspended in a solvent and using a propellant. Unlike the MJ Gordon #909C, both the solvent and the propellant are REACH and RoHS compliant. As a carnauba wax based released agent it has excellent compatibility and great release properties. However, a small downside of using a REACH and RoHS compliant solvent and propellant is that it is unfortunately flammable.
Four (4) “non-silicone” candidates were evaluated alongside the benchmark MJ Gordon #909C
Semiconductor Grade Epoxy Molding Compound was molded with 5 different “non-silicone” based release agents:
Many mold release types are INCOMPATIBLE with Epoxy Molding Compound (EMC)
Results with other mold release agents:
These bars were molded after treating the molds with other non-silicone candidates
Mold results with MRE-C909 were identical as those with MJ Gordon #909C
Results with CAPLINQ Chemlinq™ MRE-C909
These bars were molded after treating the molds with MRE-C909 and Gordon’s Carnauba spray release.
Of all the carnauba wax candidates tested, only the MRE-C909 gave the same excellent results as the MJ Gordon #909C
There was a clear difference between other "non-silicone" carnauba wax epoxy mold compound release products and the MRE-C909. Only the MRE-C909 worked like a true alternative to the MJ Gordon Persmasil #909C
AlternativesProduct Alternatives for MRE-C909 | Carnauba Wax Mold Release Spray There is no alternative for this product, but rather this product is an alternative to MJ Gordon Permasil #909C TroubleshootingGuidelines for Troubleshooting Common Issues Defect Description Try the following Blistering, heavy section lncrease cure. Close mold slowly on low pressure, then apply high pressure to purge gas. Vent mold. Preheat to eliminate moisture. lncrease preform temperature. Breathe mold as soon as possible. Increase pressure. Use stiffer material. Lower mold temperature. Check mold temperature for uniformity. Vent mold at dead ends with vent pins. Thick Flash Reduce mold charge. Reduce mold temperature. lncrease high pressure. Close on low, apply high pressure sooner. Eliminate breathing, follow (4). Use softer grade material for more pressure. Be sure of 0.002-in. between force and cavity. Be sure overfiow grooves are clean. Reduce transfer pressure andlor increase clamping pressure. Porosity (not filled out in every section) Try a range of plasticities for best grade. lncrease pressure. Lower temperature. Close mold faster if external porosity, apply high pressure sooner; close mold slower if internal porosity, apply low pressure longer Preheat material. Adjust charge weight. Try a higher density material to obtain greater "hack pressure" in the mold. Breathe mold earlier. Use semi-positive molds to minimize porosity. Mold sticking Raise mold temperature. Preheat to eliminate moisture. Clean mold. Use stiffer material. Remove dents and undercuts in mold cavity and force. Polish mold. lncrease cure. Lower pressure, softer material if plunger molding. Check knockout pin adjustment. Be sure cavities have sufficient drait. Dull surface Adjust mold temperature - usually reduce temperature for better appearance. Polish mold. Chrome plate. Close mold more slowly. Orange peel (rough, pimply surface) Close slowly on low pressure. Delay 2 sec. before applying high pressure. Preheat (radio frequency). Use stiffer material. Use finer ground material. Use large preforms and as few as ~ossible. use lower mold temperature. Pitted surface Use stiffer material. Preheat. Clouded or segregated surface. Reduce molding temperature; for colors, 300 to 310°F (150° to 155°C) Preheat preforms. Adjust plasticity. Adjust pressure and closing speed Dimpled surface Close slowly, longer on low pressure, no breathe, then high pressure. Use stiffer material. Lower mold temperature. lncrease charge weight. Shape preforms more closely to piece. lncrease pressure. Warped piece Heat mold more uniformly. Use stiffer material. Preheat if soft plasticity. lncrease cure. Use lower shrinkage material. and/or material more rigid at discharge. Redesign mold; use wider knockout pins. Adjust temperature of force arid cavity - lower temperature may reduce warpage. Preheat for irregular shaped pieces. Cool uniformly and use shrink fixtures. Cracking after molding lncrease wall thickness around inserts. Check knockout pins. Correct size of shrink fixture. Use more flexible material. lncrease radii and ribs. Oven anneal 2 hr. at 200°F. Poor electrical properties Close slowly. Preheat 1.5 hrs. at 185°F. Increase cure. Reduce temperature. Use stiffer grade. Weak Mechanically Increase temperature. Increase cure. Increase pressure. High frequency preheat. Increase charge. Afterbake to increase strength, if economical. Try 2 hr. at 250°F (120°C) Pimpling Breathe mold. Use higher fines material. Use softer material. R.F. preheat. Lower mold temperature, Burn Marks Reduce preheat temperature. Reduce mold temperature. Open gates; be sure vents are * clear; check plunger travel time to see if it is between 5 and 12 sec. (faster close will entrap gas; slower close causes burn marks). Avoid or minimize breathing. Material CompatibilityMaterial Compatibility Chart (Measured as % of Material Properties Retained) Material Product in Development SOLVENT BASED NON-FLAMMABLE MRE-C907 WATER BASED NON-FLAMMABLE MRE-C909 SOLVENT BASED FLAMMABLE Tensile Strength Maximum Displacement Tensile Strength Maximum Displacement Tensile Strength Maximum Displacement ABS A A A A A A Acetal A A A A A A Acrylic B C A C C C Epoxy A A A A A A PEI A B A B A B PET A A A A A A Polycarbonate A C C C A C Polethylene A B A A B A Polypropylene A C A C A C PPO A C A C B C PPS A A A A A A SBR Rubber A C A C A B *A - Material Property Retention of 90-100+% .......................Highly Compatible *B - Material Property Retention of 80-89+% ........................Moderately Compatible *C - Material Property Retention of Less than 80% ................Not Compatible 1. The products herein are for industrial use only; suggestions for use are made without warranty expressed or implied 2. These data are intended as a guide; specific applicability must be ascertained through product testing within particular manufacturing conditions and parameters. 3. Prior to use ALL LABEL WARNINGS as well as those within the Safety Data Sheet (SDS) must be read and understood. 4. The testing was completed at an independent ISO 9002 certified laboratory. 5. Additional Test Data as well as methodology available upon request.
There is no alternative for this product, but rather this product is an alternative to MJ Gordon Permasil #909C