Sensors

Sensors

MEMS, Cameras, Fingerprints

Humidity and temperature sensors

Optical Sensors

Optical sensors are primarily separated into through hole, surface mount and map molded surface mount devices and are used for light sensing and data transmission.

Optoelectronic molding compound requirements.

Data transmission sensors need to operate on the 680nm wavelength range while light sensors should be able to operate either on the visible light spectrum (400-700nm) or on the infrared range (800-1500nm)

When it comes to package types, Through hole doesn't require MSL and the CTE is less important. Surface mount requires a certain MSL level while CTE is still not as important. And finally Map molded surface mount where both MSL needs to be attainable while CTE needs to be fine tuned to the substrate so that we avoid shrinkage and warpage.

 

Through Hole Package Type
Key Application Requirements
  • High transmittance in visible & IR Wavelengths
  • Low cost and miniature
  • MSL data is not critical

Key Material Requirements
  • Clear, high transmission, specifically @400nm-1500nm
  • High hot hardness to be removed properly from molds
  • High adhesion to metal leadframes (Ag, Ni, Pd, Au & Cu)
 
Surface mount Package Type
Key Application Requirements
  • High transmittance in Red & IR Wavelengths
  • Low cost and miniature
  • Trade-offs of transmission for higher MSL data is possible
  • Device MAY or MAY NOT be MAP-molded

Key Material Requirements
  • Clear, high transmission, specifically @400nm-1500nm
  • High hot hardness to be removed properly from molds
  • High adhesion to metal leadframes (Ag, Ni, Pd, Au & Cu)
  • Possibly filled for better MSL performance
  • If MAP molded, low CTE is required

 

For Through hole devices, there are some products that are "tried and true" and have proven their value in the industry. TC 8020T comes as a breakthrough product with better moldability, lower moisture absorption, better MSL level and heat resistance. On top of that, the adhesion to Cu is better than the main competitive choices.

 

 

Units

XX324H-11000

XX18

CAPLINQ
TC-8020T

Specific Gravity

g/cc

1.25

1.33

1.23

Spiral Flow @ 150°C

inches

82

37

78

Hot Plate Gel Time @ 160°C

seconds

30

45

30

Cure Conditions

 

4min@150°C
+ 3hrs@150°C

4min@150°C

+ 3hr@150°C

4min@150°C

+ 3hr@150°C

Hardness

Shore D

86

85

86

Mold Shrinkage

%

1.6

1.6

1.6

Tg by TMA

°C

130

125

125

CTE by TMA, Alpha1

CTE by TMA, Alpha2

ppm/°C

65
170

70
180

70
170

Moisture absorption
  1 hr @ 95°C

   24hrs @ 25°C


%


0.32
0.16


0.77
0.40


0.32

0.17

Flexural Strength @25°C

Flexural Modulus @25°C

MPa

Gpa

129
3.2

107
3.6

130
3.0

Refractive Index @633nm

-

1.57

1.52

1.56

Transmittance @460nm, initial

%

>90%

>90%

> 90%

                after 10,000 hrs @ 125°C

%

83%

72%

86%

                after   1,000 hrs @ 150°C

 

63%

27%

68%

MSL JEDEC Level Capable

-

MSL 4

MSL 4

MSL 3


Die attach Requirements

  • Application by printing, dispensing, jetting & pin transfer
  • High adhesion on LCP & metal finishes
  • Low outgassing