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TC-8040 | Optically clear Molding Compound

Harmonization Code : 3907.30.00.15 |   Epoxide resin, halogen-free
TC-8040 | Optically clear Molding Compound
TC-8040 | Optically clear Molding Compound
TC-8040 | Transparent Molding Compound
TC-8040 | Optically clear Molding Compound
TC-8040 | Transparent Molding Compound
Main features
  • High reliability
  • 7 segment monochrome LED
  • Medium blue ray decay

Product Description

TC-8040 is a high-performance optically clear epoxy developed for high reliability white chip monochrome LED applications. This anhydride cured, monocomponent BisA and Cycloaliphatic combination achieves superior adhesion performance and great transmittance. Its stability at high temperature aids towards a good package performance and long life. It works very similar, if better than XX600H product types.

TC-8040 is able to offer medium blue-ray decay . This anti blue light epoxy features good moisture resistance and passes TCT, PCT and IR reflow testing with good discolouration results. It is a reliable product that passes reflow thermal cycling test at 85°C @85% relative humidity and is ideal for 7 segment indicator LEDs.

Product Family
TC8040  
10Kg Box
450 nm
13 mm 14 mm 16 mm 35 mm
2.9 gr 2.5 gr 3.2 gr 25 gr

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 1.22
Chemical Properties
Water Absorption 0.17 %
Mechanical Properties
Hardness
Hardness
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Durometer (Shore D) 86
Flexural Modulus
Flexural Modulus @ 25°C 3600 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
 110 N/mm2
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 81 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 175 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 160°C / 320°F 20 - 45 sec
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 135 °C
Spiral Flow
Spiral Flow @ 175°C 150 - 250 cm
Curing Conditions
Curing Schedule
Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Cure Time 3 - 5 min
Mold Temperature 140 - 160 °C
Preheat Temperature 40 - 80 °C
Transfer Pressure 10 - 40 kg/cm2
Transfer Time 20 - 50 s
Post Mold Cure
Post Mold Cure @ 150°C / 302°F 4 hrs

Additional Information

Low light decline requirement:
10-50% - RT * 5mA * 1000hrs