TMC-8040 | Optically clear Molding Compound

Harmonization Code : 3907.30.00.15 | Epoxide resin, halogen-free

TC-8040 | Optically clear Molding Compound

Main features

High reliability
7 segment monochrome LED
Medium blue ray decay

Product Description

OPTOLINQ TMC-8040 is a high-performance optically clear epoxy developed for high reliability white chip monochrome LED applications. This anhydride cured, monocomponent BisA and Cycloaliphatic combination achieves superior adhesion performance and great transmittance. Its stability at high temperature aids towards a good package performance and long life. It works very similar, if better than XX-600H product types.

TMC-8040 is able to offer medium blue-ray decay . This anti blue light epoxy features good moisture resistance and passes TCT, PCT and IR reflow testing with good discolouration results. It is a reliable product that is targetin at the stringent MSL 3/2A JEDEC requirements.

OPTOLINQ TMC-8040 is developed based on TMC-8020T with improved moisture resistance and anti-blue decay properties. Check the Reliability Test Comparison between TMC-8040 and TMC-8020T.

Typical Applications

Low-Power LED & Emitters
Pulse Oximeter Sensors
Ambient Light Sensors
IR and Near-IR Sensors
Data transmission and industrial fibers.

Comparable With: XX-600

Product Family
TMC8040

1. Select Package Type

10Kg Box

2. Available Transmittance

450 nm

3. Available Pellet Size

13 mm 14 mm 16 mm 35 mm

4. Available Pellet Weight

2.9 gr 2.5 gr 3.2 gr 25 gr

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

In stock

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.22

Physical Properties

Spiral Flow @ 175°C

150 - 250 cm

Chemical Properties

Water Absorption

0.17 %

Mechanical Properties

Hardness Hardness Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Durometer (Shore D)	86

Flexural Modulus
Flexural Modulus @ 25°C	3600 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	110 N/mm2

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE) , α1 Coefficient of Thermal Expansion (CTE) , α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	81 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	175 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 160°C / 320°F	20 - 45 sec

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

135 °C

Curing Conditions

Curing Schedule Curing Schedule Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV. Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure. There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure. Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Cure Time	3 - 5 min
Mold Temperature	140 - 160 °C
Preheat Temperature	40 - 80 °C

Post Mold Cure
Post Mold Cure @ 150°C / 302°F	4 hrs

Transfer Pressure

10 - 40 kg/cm2

Transfer Time

20 - 50 s

Additional Information

TMC-8040 V.S. TC-8020 Reliability Tests

Both TMC-8020 and TMC-8040 pass the reflow tests and double 85 tests, showing no dead lights and no color shift in substrates. TMC-8040 has improved moisture-resistance property, compared with TMC-8020 series and better performance in pressure cooking test (PCT) and blue decay test. TMC-8040 is suitable for surface mount packages, requiring MSL3 & 2A.

TEST	PRODUCT	TEST CONDITION	RESULT
IR Reflow	TMC-8020L	3 x 30 sec @260°C, IR Reflow	Pass
IR Reflow	TMC-8040	3 x 30 sec @260°C, IR Reflow	Pass
Double 85 Test	TMC-8020L	5V * 20mA, 75hrs @85°C * 85%RH	Pass
Double 85 Test	TMC-8040	5V * 20mA, 75hrs @85°C * 85%RH	Pass
Thermal Cycling	TMC-8020L	-40°C~100°C, 200 cycles	Pass
Thermal Cycling	TMC-8040	-40°C~100°C, 200 cycles	Pass
Pressure Cook	TMC-8020L	2 x 8hrs @121°C, 100%RH, 2 atm	Fail
Pressure Cook	TMC-8040	2 x 8hrs @121°C, 100%RH, 2 atm	Pass