Hysol GR60 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Main features

Designed for IPM application
Good moisture resistance
High thermal conductivity

Product Description

Hysol GR60 Series is a black semiconductor-grade epoxy molding compound designed for the encapsulation and protection of intelligent powder module (IPM) applications. With excellent workability and reliability, GR60 series is suitable for long wire or large body devices. With high thermal conductivity (1.7 ~ 2.2 W/mk), GR60 could be applied in SiC IGBT module with Tj 175°C and 1200V. More thermal conductive versions are also under development. Hysol GR60 is an environmentally "green" product, meaning that it doesn't contain any halogens including bromine, antimony or phosphorus flame retardants. Hysol GR60 meets UL 94 V-0 Flammability at 1/8 inch thickness. Key features are summarized as:

Reliability (check GR60 HT beta-site tests)

High adhesion to Cu/Ag/Ni
Low stress and low water absorption
High thermal conductivity
Excellent performance in HAST, HTRB, TC, PCT, HTS, etc.

Moldability

Excellent workability with wide process window
No wire sweep
Good warpage control

Available versions: GR60 HT, GR60 PT (check the GR60 comparison)

Suitable Package: Full pack type IPM, substrate type IPM

Product Family
GR60

1. Select Product Form

Pellet

2. Available Pellet Size

16 mm

3. Available Pellet Weight

7.6 gr

4. Available Package Size

10 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

black

Filler Content

87 %

Physical Properties

Spiral Flow @ 175°C

152.4 cm

Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

13 mPa.s

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	9 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	4 ppm

Moisture absorption

0.34 %

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	22580 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	145 N/mm2

Electrical Properties

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

8.3x10¹⁵ Ohms⋅cm

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	8 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	29 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	30 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

107 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

0.9 W/m.K

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

V-0 @ 1/8 inch

Additional Information

Property	GR60PT(98D69B)	GR60PT(102A11)	GR60HT	GR60 (M1)
Filler content	83	86	86	87
Epoxy	EOCN+LWA1	EOCN+LSR	EOCN/LWA2	MAR+LWA2
Gel Time (sec)	32	30	40	30
Spiral Flow (inch)	40	29	24	60
Tg (°C)	172	117	119	107
CTE 1	20	15	19	8
CTE 2	61	49	44	29
Flexural Strength/Modulus, Mpa	116/ 17925	110/ 21112	137/ 19625	145/ 22580
DMA-Flexural Modulus (RT)	21141	25377	-	26971
DMA-Flexural Modulus (175/260°C)	2377/795	613/453	-	888/ 647
PCT 24hrs wt%	0.45	0.22	0.20	0.34
CI-, ppm	34	18	9	9
Na+, ppm	5	3	8	4
pH, ppm	7	7	6	5
Volume Resistivity, 10E15 Q	2	7	4.09	83
Thermal Conductivity, W/m.K	1.9	1.8	2.2	0.9

Epoxy Molding Compound For IPM Application

Hysol has developed different series (GR60 series, GR600 series, GR750 series, etc.) for IPM application. Highly conductive versions are also in development.

Beside the common features, the two version GR60 PT and GR60 HT have their own unique features to meet niche requirements for your module. The differences between GR60 PT and GR60 HT:

Thermal conductivity: 1.7 W/mK (GR60 PT) v.s. 2.2 W/mK (GR60 HT)
Good adhesion to: Cu & Au surface (GR60 PT) v.s. Cu & Au & Ni surface (GR60 HT)
Others: high cost-efficient (GR60 PT) and good moisture resistance (GR60 HT)

GR60 Series For IPM Application

Hysol GR60 series products are highly thermal conductive molding compounds designed for IPM applications. Both GR60 HT and GR60 PT are dedicated to module package with excellent workability and reliability, suitable for long wire or large body device. The key common features of GR60HT and GR60PT are:

Workability