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Leadframes for IC Semiconductor Assembly

Cu, Ag, NiPd & PPF plated Leadframes



Caplinq provides a large variety of Leadframes for Semiconductor package assembly, ranging from Bare Copper (Cu) to Silver(Ag), NiPd (Nickel Palladium) and PPF (Nickel Palladium Gold) platings.

We can manufacture Pre plated custom leadframes for all types of packages including but not limited to QFN, PLCC, QFP, HDL, PDIP, TSOP, SOIC, SQP, DIP, TO220, FDIP, SIP and SOP. You name it, we make it. We can also explore options for thinner and higher thermal dissipation packages.By leveraging a smart and adjustable production process we can honour low volume orders for IC package manufacturers that want to experiment with new and alternative packaging approaches.

Additionally, epoxy molding compound manufacturers and companies that might want to test their Molding compounds in house can take advantage of our flexible and adjustable Pull tab adhesion leadframes. Our current range includes one of the most popular strip designs with 8 units per strip in 4 different platings. We are able to manufacture and plate your own custom designs so reach out to us for a quotation.