MCL-T33 | Melamine Transfer Cleaning Tablet

Harmonization Code : 3909.20.10 |   Melamine Formaldehyde Resin
Main features
  • Transfer grade
  • Designed for semiconductor molds
  • High adhesive strength

Product Description

CHEMLINQ MCL-T33 is a transfer-type formaldehyde-free melamine mold cleaning pellet designed for cleaning transfer molding equipment and epoxy molds. This melamine based cleaner is specially designed for cleaning Epoxy mold compound (EMC) residue from Packaging molds used for the encapsulation of semiconductors and IC packaging. It is a proven and widely used mold cleaning material that has been used in the industry for more than 20 years.

MCL-T33 has excellent cleaning abilities with a melamine resin system that exhibits high adhesive strength and assists in capturing the stains and residues from the molding equipment. Its improved workability and excellent cleaning performance reduce the total cleaning time and make it a great drop-in solution for transfer cleaning processes. Contact us for pellet sizes and weight.

Product Family
MCL-T33  
8 gr
16 mm

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Appearance
Appearance
Appearance at room temperature.
 White
Density (g) 1.2 - 1.5 g/cm3
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 1.3 - 1.5
Physical Properties
Spiral Flow @ 175°C 51 - 127 cm
Curing Conditions
Curing Schedule
Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Cure Temperature 160 - 190 °C
Cure Time 5 - 8 min
Transfer Pressure 0.02 - 0.15 Kg/mm2

Additional Information

MCL-T33  Package types

Property Mini Pellets Large Pellets Units
Diameter 13, 14, 16, 18, 20 40, 48, 50 mm
Weight 2.8 - 18 30 - 100 g

Directions for Use

Cleaning with melamine transfer compounds can be introduced in multiple steps of the cleaning process, depending on your molding process.

  1. Pre-heat the mold to standard operating temperature. Ensure that debris and other contaminants have already been removed.
  2. Add appropriate number of MCL-T33  pellets into the mold cavity. The amount of pellets added vary per mold size and level of contamination.
  3. Seal the mold and start a standard transfer molding cycle. The heat and pressure during the cycle activate the melamine cleaning compound, allowing EMC residues to be dislodged. 
  4. Remove the melamine cleaning pellets and inspect the mold surface. If there are still residues on the surface, repeat the process or use CHEMLINQ Rubber Cleaning Sheets.

Storage conditions

CHEMLINQ MCL T33 Melamine Cleaning tablets have a shelf life of 12 months if they are stored in a cooled environment. Work life is 4 days after taking them out of storage.