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Thermal Gap Pads (TGPs) provide high thermal performance with ease of use for many applications. Ultra-high compressibility enables low stress and excellent conformity to mating surfaces. Honeywell Thermal gap pad models are naturally tacky, and require no additional adhesive which could inhibit thermal performance.
Thermal gap pads provide thermal performance with ease of use across a multitude of applications. They have been designed to minimize thermal resistance at interfaces, exhibit minimal bleeding and maintain effective performance through reliability testing. TGP models are silicone based, therefore they offer a certain anti-shock effect, with electrical isolation and non-flammability. While all interfaces bleed (with zero exceptions), our pads exhibit very low bleeding even under pressure due to the low molecular weight of the remaining unlinked chains.
A range of thicknesses from 0.5mm to 5.0mm are available. Honeywell TGP models come with two surface liners, which enable users to remove the liner after installation (before operation), with no contaminant risk and easier handling.
All values mentioned above are typical values and not product specifications. The technical data contained herein are intended as reference only. Please contact Honeywell or Caplinq for assistance and recommendations on specifications for this product.
TGP model thermal gap pads are available in standard sheets and also custom die-cut parts, and in a range of thicknesses. It is very important to understand that the applied pressure will directly affect the bondline thickness and the thermal impedance values
Thickness Range: 0.5-5.0mm with 0.25mm incremental
Thickness Tolerance: >1mm, ±10% 0.5-1mm, ±0.1mm
Product shelf life is guaranteed when it is stored in the suggested conditions under controlled humidity. After the product "expires" the most readily observed response is precut pads (kiss-cut) tend to stick to each other and there is difficulty peeling out one without damaging adjacent one. There will be some viscosity change that may or may not affect thermal performance and we will not test or recertify material. We will not be liable for product quality or performance issues if expired parts are used in manufacturing.
Thermal Gap Pads are normally used in operating temperatures up to 80°C - this being the maximum temperature of the surrounding area. However, because of chemistry of these pads, they can easily withstand temperatures from -60 up to 200°C
Unless it is otherwise listed, the dielectric strength of the gap pads is around 5 - 7 kV/mm while High voltage versions have a dielectric strength around 7.6 - 7.9 kV/mm. Since air voids can occur it is hard to guarantee the exact Breakdown Voltage but you can take 5000V as the base value for non HV version pads. We are actively researching higher Dielectric Strength product versions. Contact us for developmental pads that can reach up to 9.6 kV/mm.
Thermal Gap Pads thicker than 1mm are reinforced with a fiberglass lining.
Gap filler is a Thermal interface material that exists between heat dissipating and heat generating surfaces and takes up the tolerance variation.It is silicon based, filled with TC fillers such as Bn,Zn and Alumina and comes in sheet (gap pad) or dispensable (putty) form.
Surprisingly enough there are no set test methods to control bleeding of Thermal gap pads. As a general rule of thumb there's NO thermal gap pad in the industry right now that doesn't bleed.
Silicone pads can and will bleed given the right circumstances, regardless of manufacturer. That doesn't mean that Silicone free pads are not prone to it. Silicone free pads will also bleed. They will just not bleed Silicone.
Bleeding is different than outgassing. It concerns longer molecular chains and it depends on a variety of parameters.
Bleeding depends on the pressure differential on the pad, how much free (not cross linked) silicone remains and the molecular weight (length) of the remaining unlinked chains. In this case, pressure plays a much bigger role than heat and orientation.
While bleeding tests are not standardized, Dielectric strength testing is quite straightforward. The sample is placed between two 25 x 25mm Copper electrodes in ambient temperature and 65% ambient relative humidity while the voltage is raised by 0.1kV/s until the AC current crosses through.Optically, this cross through is usually in a form of a pinch/hole in the material, sometimes invisible to the bare eye.
Test are being conducted in a Dielectric strength tester - HJC-10KV at the time of writing of this content.