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LOCTITE® ABLESTIK 8322A adhesive is designed for medium die attach applications. Improvements in epoxy resin and adhesion technology were incorporated into this adhesive for maintaining significant bond strength after exposure to elevated temperatures and humidity.
LOCTITE® ABLESTIK 8322A is a snap curable epoxy with minimal resin bleed and low condensable volatiles. It is suitable for large device bonding with great resistance to delamination with excellent dispensability that is engineered for accurate bondline control.