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LOCTITE ABLESTIK QMI529HT

Harmonization Code : 3506.91.90.99 |   Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Loctite Ablestik QMI529HT
Loctite Ablestik QMI529HT
Loctite Ablestik QMI529HT
Main features
  • Void free bondline
  • Excellent thermal conductivity
  • Stable at high temperatures

Product Description

LOCTITE ABLESTIK QMI529HT die attach paste was developed as a soft-solder replacement or for high UPH performance applications. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater.

Taking the relatively high viscosity and thixotropy of QMI 529HT into account, we believe that it’s worth testing this world wide established and proven die attach paste using stencil printing in parallel. QMI 529HT should have the potential to print small dots like ~100um diameter.

LOCTITE ABLESTIK QMI529HT is a hydrophobic BMI/acrylate product that exhibits excellent electrical and thermal conductivity and is stable at high temperatures. It offers high resistance to delamination and excellent adhesive strength with a void free bondline.

LOCTITE ABLESTIK QMI529HT works great on Copper, Silver plated copper, Preplated NiPdAu leadframe and Alloy 42, has high resistance to heat and humidity and good resistance to "popcorning" after exposure to reflow temperatures.

 

Snap Cure

  • 60 seconds @ 185°C

Oven Cure

  • 30 minutes @ 185°C or
  • 30 minutes @ 200 to 220°C (for higher adhesion)
Product Family
QMI529HT  
10cc EFD Syringe 5cc EFD Syringe

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 8 - 12 weeks In stock
Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -40°C 365 days
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 4.10
Work life @25°C
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.
 24 hours
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
 20 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
 20 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
 20 ppm
Mechanical Properties
Tensile Modulus
Tensile Modulus
Tensile modulus is a mechanical property that measures the stiffness of an elastic material. It is the slope of stress / strain curve of a material under direct tensile loading.

It can be used to predict the elongation or elastic deformation of an object as long as the stress is less than the tensile strength of the material. Elastic deformation is caused by stretching the bonds between atoms and the deformation can be reversed when the load is removed.

Tensile modulus is affected by temperature and is an important engineering attribute since we generally want to keep elastic deformation as small as possible.
Tensile Modulus @25°C 3,300 N/mm2
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Thixotropic index
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
 4.8
Viscosity 18,500 mPa.s
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 53 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 156 ppm/°C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 3.3 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 6.5 W/m.K

Additional Information

QMI529HT used to be available in Techcon syringes with sticking rubber pistons. These became slowly obsolete and phased out for the superior EFD syringes. If you already have a Techcon setup you will need to buy an EFD adapter for ~50 EUR (we don't sell those) and you can immediately start using EFDs.