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PTM 7950-SPS | Phase Change Paste

Harmonization Code : 3824.99.96.99 |   Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
  • 0.04 Thermal Impedance
  • 8.5 Thermal Conductivity
  • Slow drying solvent

Product Description

PTM7950-SPS is an identical version of PTM7950-SP but with a slow drying solvent (S). It is a super highly thermally conductive Phase Change Material (PCM) in both pad and paste formats, is designed to minimize thermal resistance at interfaces, maintain excellent performance through reliability testing, and provide scalable application at a competitive cost.

PTM7950-SPS  is based on a novel polymer PCM system and exhibits excellent interface wetability during typical operating temperature ranges, resulting in extremely low surface contact resistance.

PTM7950-SPS is a proprietary material provides superior reliability (pass 150˚C baking 1000 hours, T/C-B 1000 cycles) and maintains low thermal impedance (<0.04˚Ccm2/W @ no shim), making it desirable for high performance integrated circuit devices.

Product Family
1Kg Jar 300cc Al cartridge

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Technical Specifications

General Properties
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Thickness range 0.25 mm
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
2.1x1014 Ohms⋅cm
Thermal Properties
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
8.5 W/m.K
Thermal Impedance 0.04 °C·cm²/W

Additional Information

When choosing a printable paste it is important to understand the process parameters and limitations.

That's why we ask, when you contact us, to include  the following information:

  1. What is your print thickness?
  2. How long is your printing time and working window?
  3. What is your drying step after printing?
    • Temperature (Room temperature or something else?)
    • Time 
  4. Do you have any viscosity limitations in the printing process?
Reminder: The SPS version of PTM7950 is identical in properties and only differs in the rate that the solvent dries.

Product Use
Clamping pressure and temperature are suggested to achieve a minimum bond line thickness of the thermal interface material, typically less than 1.5 mil (0.038mm) for best performance.
The material must go through the phase change temperature to exhibit entitlement performance.
(ASTM E1461)
End of Line
Bake 150˚C, 1000 h 0.04˚C-cm2/W
Double 85, 1000h  0.04˚C-cm2/W
Temperature Cycling “B” 
(-55˚C to +125˚C, 1000 cycles)
PTM7950 is ideal for high performance IT/Enterprise computing applications.

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