Semi sintering die attach pastes are resin based drop in solutions, identical to standard die attach paste applications but without the need for high pressure and temperature for sintering. They are characterised by excellent workability, allowing for consistent dispensing for 24 continuous hours, without silver settling or separation. Lead-free die attach materials that offer simplified processing, robust reliability and best-in-class thermal and electrical performance for high power density semiconductor packages.
Sintering products on the other hand have different process requirements and are solvent based, making them a possible but not ideal option for semiconductor packages. Their thermal capabilities are through the roof but the fact that they contain solvent (that could potentially popcorn) makes them struggle with MSL requirements. They are stencil printable, mainly targeted towards High thermal package applications that use metalized back side die, Ag or Au coated substrates or other metalized leadframes.