Sn96.5/Ag3.5-PF | Solder Preform

Harmonization Code : 8001.20 | Unwrought tin: Tin alloys

Main features

Mid-range temperature alloy for BGA/CSP and die attach components in high power devices
High joint strength
Highly resistant to thermal fatigue

Product Description

LINQALLOY Sn96.5Ag3.5-PF is a high-performance mid-temperature range lead-free solder preform developed for applications demanding high reliability. Its optimized Sn96.5Ag3.5 alloy composition makes this solder preform ideal for ball grid array (BGA) and chip scale package (CSP) components, as well as die attach materials in high-power devices. With excellent wetting, high joint strength, and resistance to thermal fatigue, Sn96.5Ag3.5-PF ensures strong, reliable solder joints in electronic devices, providing durability and consistency in the soldering processes for various electronic assemblies. Its eutectic melting temperature is 221 °C.

LINQALLOY Sn96.5Ag3.5-PF is manufacture using high-purity raw materials. Rigorous quality control measures are in place to significantly minimize alloy oxidation and mitigate the presence of harmful metals and non-metallic impurities. Sn96.5Ag3.5-PF is available in a wide range of shapes, including ribbon, rectangular (square) sheets, circular sheets, rings, and can even be customized to fit your unique specifications.

Available Shapes and Corresponding Dimensions

Shape	Dimension
Rectangular or Square Sheets	Width	1–30 mm
	Thickness	0.10–0.50 mm
	Length	1.5–60 mm
Ribbons	Width	1–60 mm
Ribbons	Thickness	0.10–0.50 mm
Washer	Outer Diameter	3–60 mm
	Inner Diameter	2–25 mm
	Thickness	0.10–0.50
Disc or Round Sheets	Outer Diameter	2–60 mm
Disc or Round Sheets	Thickness	0.10–0.50 mm

Specifications
Additional Information

Technical Specifications

General Properties

Alloy Composition

Alloy Composition
Composition of the alloy material

Sn96.5Ag3.5

Thermal Properties

Melting Temperature
Eutectic Melting Temperature Eutectic Melting Temperature Eutectic melting temperature is the precise temperature point at which an alloy turns from pure solid to liquid. Eutectic alloys are unique. They do not have a Solidus / Liquidus melting range but they have a single temperature point at which the alloy immediately becomes liquid and vice versa.	221 °C

Additional Information

LINQALLOY Sn96.5Ag3.5-PF Chemical Composition

Element	Concentration (%w/w)
Element	IPC J- STD006C Standard	Sn96.5Ag3.5-PF
Tin (Sn)	Remainder	Remainder
Lead (Pb)	Max 0.070	Max 0.050
Aluminium (Al)	Max 0.005	Max 0.005
Antimony (Sb)	Max 0.200	Max 0.050
Arsenic (As)	Max 0.030	Max 0.030
Bismuth (Bi)	Max 0.100	Max 0.050
Copper (Cu)	Max 0.080	Max 0.080
Iron (Fe)	Max 0.020	Max 0.010
Zinc (Zn)	Max 0.003	Max 0.003
Cadmium (Cd)	Max 0.002	Max 0.002
Silver (Ag)	-	3.30–3.70
Nickel (Ni)	Max 0.010	Max 0.010
Indium (In)	Max 0.100	Max 0.050
Gold (Au)	Max 0.050	Max 0.050

Handling and Storage

The shelf life of Sn96.5Ag3.5-PF is 12 months from the manufacturing date when handled with care. To preserve its quality, store the preforms in a dry and non-corrosive environment, minimizing the risk of oxidation. It is crucial to ensure the packaging remains intact, preventing exposure to dust and other foreign materials.