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Hysol GR300S | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 |   Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
  • Low CTE (15 ppm/°C)
  • Low stress
  • High productivity

Product Description

Hysol GR300S is a black, epoxy molding compound used for optical applications. This partly fused silica filled (77%) product has been designed for optocouplers also knows as photo-couplers, optical isolators, or opto-isolators. It is also used for SMX, SOD, BRG, TO and DIP applications.

Hysol GR300S is a heat curable epoxy with low wire sweep, low stress and a low coefficient of thermal expansion. It has a flammability rating of UL94 V-0.

Product Family
GR300S  
Pellet
13 mm
4.4 gr
15 kg

Catalog Product

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Technical Specifications

General Properties
Color
Color
The color
Black
Filler Content 77 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.9
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 365 days
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
10 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
3 ppm
Moisture Absorption
Moisture Absorption
Moisture absorption shows the capacity of a polymer to absorb moisture from its environment.

Absorbed moisture can reduce the glass transition temperature and strength of a polymer and can also result in popcorning, unreliable adhesion or voids in the bond line due to moisture desorption or entrapment.

Moisture absorption should always be mentioned with the test conditions to provide a meaningful frame of reference.
Moisture absorption 0.35 %
Mechanical Properties
Water Extract Data
Water Extract Data
Water Extract Data, 20hrs water boil
Conductivity 22 mmhos/cm
pH of extract 5.8
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
145 N/mm2
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
15 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
52 ppm/°C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
169 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.7 W/m.K
Spiral Flow
Spiral Flow @ 175°C 84 cm
UL94 Rating
UL94 @ 1/8 inch V0
Curing Conditions
Curing Time
Curing Time @ 175°C / 347°F 70 - 90 s
Mold Temperature 165 - 180 °C
Preheat Temperature 85 - 90 °C
Transfer Pressure 40 - 70 kg/cm2
Transfer Time 10 - 25 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 3 - 4 hrs

Additional Information

Storage

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.

Optimal Storage: 5°C or below, in closed containers. After removal from cold storage, the material MUST be allowed to come to room temperature, in the sealed container, to avoid moisture contamination. The suggested waiting time for a standard 15 kg carton box is 24 hours.