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Hysol GR700 C4C is a halogen free, black, silica filled (89% filler weight) semiconductor grade epoxy molding compound with a 75um filler cut size. This low stress, high adhesion compound has very good electrical performance and is currently under development, striving to provide high reliability for high power applications.
Hysol GR700 C4C is a green epoxy molding compound with excellent electrical performance, designed for high power devices applications with low moisture absorption requirements. Typical use can be found in SOP, DPAK, QFP, QFN semiconductor packages. Furthermore, it meets UL 94 V-0 flammability at 1/8 inch thickness.