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LOCTITE ABLESTIK 2033SC die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries. This monocomponent low bleed product has long work life and can cure fast at low temperatures, making it ideal for smart-card applications.
LOCTITE ABLESTIK 2033SC is a mature and price efficient product. Legacy smartcard products could and should be served by 2033SC. For new applications and snap cure materials though we suggest you take a look at LOCTITE ABLESTIK 2035SC and LOCTITE ABLESTIK 2035SCR.