Specialty Chemicals, Adhesives & Plastics
Only signed in users will see discount codes and have complete access to product lines, datasheets and pricelists
LOCTITE® ABLESTIK 8387BΜ non conductive epoxy die attach adhesive has been formulated for use in high throughput die attach applications. It has been used for the glass attach of Optical and 3D sensors and has been successfully used for lid attach in aerospace and defence applications. This non conductive adhesive can be used as an encapsulant and has black pigmentation for blocking stray light.
LOCTITE® ABLESTIK 8387BΜ is a low temperature cure material that has the unique ability to be a 2 in 1 solution for both die attach and glob top encapsulation applications.