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Solder pastes

Best-in-class thermal performance, flexibility, reflow and reliability

AVAILABLE DIRECTLY AT CAPLINQ.COM
Die Attach FilmsDie Attach PastesSemi Sintering Die Attach PastesSolder PastesWafer Backside Coatings

Solder Pastes

We offer a portfolio of solder die attach pastes that deliver the process flexibility, thermal performance, high reliability and ease of use that modern power device manufacturers demand. They provide the thermal management necessary for today’s smaller outline, higher functioning semiconductor power devices, while also delivering the processability and versatility associated with solder paste materials.

Optimized rheology allows for printing or dispensing depending on process preferences and advanced flux technology is compatible with a wide range of reflow profiles to enable alloy adaptation when required. These products offer robust options for application-specific thermal requirements and overcome many of the issues historically associated with alternative products.

Product Selector Guide

Solder Pastes for Wirebond Laminate Packaging
Product Description Key attributes Alloy Particle size distribution Viscosity at 25°C (cP) Reflow atmosphere IPC J-STD 004B Classification Shelf life
Dispensable
Loctite HF 250DP Halogen-free, Pb-free, no-clean solder paste - Low voiding
- Exceptional dot-to-dot consistency
- High-speed dispense capability with zero slump
- Colorless residues		 SAC387 Type 5 160,000 at 5 rpm Nitrogen Rolo 12 months up to -18°C
Printable
Loctite GC 10 Temperature-stable, halogen-free, Pb-free, no-clean solder paste - Low voiding
- Exceptionally long stencil life and abandon time
- Outstanding paste transfer efficiency
- Excellent wetting and coalescence in air
- Suitable for high density, small to large boards		 SAC305 Type 3, 4, 4.5 (4A) and 5 900,000 - 933,000 at 5 rpm Designed for air; suitable with nitrogen Rolo 12 months up to 26.5°C
Loctite HF 212 Halogen-free, Pb-free, no-clean solder paste - Low voiding
- Extended stencil life and abandon time
- Printing, pin-in-paste and enclosed head print capability
- Excellent wetting and fine pitch coalescence
- Suitable for medium to large boards		 90iSC
96S
SAC0307
SAC305
SAC387		 Type 3, 4, 4.5 (4A) and 5 750,000 - 900,000 at 5 rpm Air and nitrogen Rolo 6 months at 0°C - 10°C



Solder Paste for Wirebond Leadframe Packaging
Product Description Key attributes Alloy Particle size distribution Viscosity at 25°C (cP) Reflow atmosphere IPC J-STD 004B Classification Shelf life
Dispensable
Loctite DA 100 Halide-free, no-clean solder paste with Pb-free and high-Pb options - Low color residues resistant to charring in reflow
- Very low voiding
- Vacuum-mixed for reliable dispensing performance
- Excellent dispense and pause time capability
- Robust flux effective over a wide range of reflow profiles		 2.5S
92A		 Type 3, 4 300,000 - 310,000 at 5 rpm Forming gas Rolo 12 months up to -18°C
Printable
Loctite DA 101 Halide-free, no-clean solder paste with Pb-free and high-Pb options - Low color residues resistant to charring in reflow
- Very low voiding
- Robust flux effective over a wide range of reflow profiles		 2.5S
92A
95A		 Type 3 600,000 at 5 rpm Forming gas Rolo 6 months at 0°C - 10°C

Learn More

Solder is frequently used as an alternative to conventional die attach paste when the application calls for high thermal and electrical performance. As leadframe-based devices such as SOICs, TSOPs and TSSOPs are often exposed to high temperatures during subsequent board assembly processing, high melt point alloys are important. Optimized rheology allows for printing or dispensing depending on process preferences and advanced flux technology is compatible with a wide range of reflow profiles to enable alloy adaptation when required.

Proper solder alloy formulation is vital for laminate-based packages, as the melting point must be tightly controlled to maintain the integrity of the organic substrate. Awardwinning halogen-free, lead-free solder paste materials offer low-voiding performance and can be processed at lower reflow temperatures to align with the requirements of wirebond laminate package processing.