Specialty Chemicals, Adhesives & Plastics
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We offer a portfolio of solder die attach pastes that deliver the process flexibility, thermal performance, high reliability and ease of use that modern power device manufacturers demand. They provide the thermal management necessary for today’s smaller outline, higher functioning semiconductor power devices, while also delivering the processability and versatility associated with solder paste materials.
Optimized rheology allows for printing or dispensing depending on process preferences and advanced flux technology is compatible with a wide range of reflow profiles to enable alloy adaptation when required. These products offer robust options for application-specific thermal requirements and overcome many of the issues historically associated with alternative products.
Solder is frequently used as an alternative to conventional die attach paste when the application calls for high thermal and electrical performance. As leadframe-based devices such as SOICs, TSOPs and TSSOPs are often exposed to high temperatures during subsequent board assembly processing, high melt point alloys are important. Optimized rheology allows for printing or dispensing depending on process preferences and advanced flux technology is compatible with a wide range of reflow profiles to enable alloy adaptation when required.
Proper solder alloy formulation is vital for laminate-based packages, as the melting point must be tightly controlled to maintain the integrity of the organic substrate. Awardwinning halogen-free, lead-free solder paste materials offer low-voiding performance and can be processed at lower reflow temperatures to align with the requirements of wirebond laminate package processing.
There are multiple types of Alloys that can be used for a wide variety of applications. Different companies tend to use different codes and abbreviations for the same alloy but at the end of the day it all comes down to the alloy composition. So don't get confused by the branding and tradenames and just focus on the metal content and the end properties. In the following table you can see the codes Henkel is using for some popular alloys.