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Liquid Encapsulants

Encapsulants for electrical insulation and mechanical protection

AVAILABLE DIRECTLY AT CAPLINQ.COM

Liquid Encapsulants

Liquid encapsulants are much more flexible than traditional Epoxy mold compounds, removing the need for expensive molding machines and molding plates. This way, they allow manufacturers to produce smaller and and more flexible batches, making the products better suited for diverse low quantity orders. Optical grade encapsulants can also have efficient application in LED encapsulation.

Encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and aluminum.

Encapsulants deliver unmatched performance for a variety of products including transistors, system in package (SIP) devices, ASICs, and chip-on-board applications. Cycle time and costs can be reduced through the use of glob tops. These materials for chip-on- board applications are designed to cure quickly to fit easily within high-speed manufacturing operations.

Liquid encapsulants are formulated and tested in-process and in the context of full package assembly. They meet the most stringent JEDEC-level testing requirements and are developed to deliver outstanding performance within high temperature lead-free environments.

Caplinq offers a wide range of Liquid Encapsulants. We are proud to offer Henkel's entire LOCTITE product line but also our own LinqSil and Optolinq products.
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22 products
Compare Products
22 products

Product Selector Guide

Encapsulant Adhesives
Product Application Viscosity at 25°C (mPa.s) Filler Type (Content) Max Filler Size, um Hardener type Tg by TMA (°C) CTE α1(ppm/°C) CTE α2(ppm/°C) Cure time (min) Cure Temp °C Available Key attributes
Dam
Loctite ECCOBOND FP4451TD BGA and memory 300,000 Silica (73%) 200 Anhydride 150 21 65 30 + 90 125+165 Yes - Ionically clean
- Tall dam
- High thixotropic index
Loctite ECCOBOND FP4451 BGA and memory 300,000 Silica (72%) - Anhydride 155 22 - 30 + 90 125+165 Superseded by FP4451TD - Designed for use with fill encapsulant LOCTITE ECCOBOND FP4450
Fill
Loctite ECCOBOND FP0087 Stress-sensitive devices and severe automotive environments 20,000 at 20 rpm Silica (76%) - - 175 18 - 60 + 60 125 + 180 No - Low stress and high flow with reduced warpage and cracking
- Low CTE
- Cavity & potting ring
- Halogen-free
Loctite ECCOBOND FP4450 Automotive, BGA, memory, COB, SIP and SmartCard 44,000 Silica (73%) 120 Anhydride 155 22 72 30 + 90 125+165 Superseded by X - Low stress and relatively high flow
- Good moisture resistance and excellent chemical resistance
- Excellent pressure pot performance on live devices up 500 hr.
- Oven cure
Loctite ECCOBOND FP4450HF Automotive, BGA, memory, COB, SIP and SmartCard 32,000 at 20 rpm Silica (73%) 25 Anhydride 164 19 71 30 + 90 125+165 Yes - Excellent chemical, corrosion and moisture resistance
- High thermal stability
- Very high flow and fine filler
Loctite ECCOBOND FP4470 BGA, CSP, and full array on low temperature co-fired ceramic (LTCC) 48,000 Silica (75%) 50 Anhydride 148 18 65 30 + 90 125+165 Yes - MSL3 260°C capable
- Excellent flow good for fine pitch wires and deep cavities
- 260°C reflow capability for Pb-free applications
Loctite ECCOBOND FP4651 Automotive, BGA, memory, COB, SIP, SmartCard and chip array ceramic packages 130,000 at 20 rpm Silica (82%) 50 - 150 11 50 60 + 90 125+165 Replaces FP4651 - Low stress
- Low CTE
- Easy to dispense
- Excellent chemical resistance and thermal stability
- Oven cure
Loctite ECCOBOND FP4654 MEMS and chip array ceramic packages 32,000 at 20 rpm Silica (80%) 50 Anhydride 146 13 53 30 + 90 125+165 Yes - Low stress and low CTE
- Excellent chemical resistance and thermal stability
- Jettable
Loctite ECCOBOND FP4802 BGA, CSP and full array on low temperature co-fired ceramic (LTCC) 80,000 at 10 rpm Silica (72%) 50 Phenolic 50 20 100 30 + 90 125+165 Yes - MSL2 260°C capable
- Low warpage
- Excellent flow good for fine pitch wires and deep cavities
Glob Top
Loctite ECCOBOND FP4323 COB and plastic PGA 220,000 at 2 rpm Silica (65%) - - 174 28 - 240 or 60 150 or 170 No - Low CTE for improved thermal cycling
- Thixotropic
- Excellent moisture and chemical resistance
- Oven cure
Loctite ECCOBOND FP4460 Automotive, BGA, memory, COB, SIP and SmartCard 300,000 at 10 rpm Silica (75%) 120 Anhydride 173 20 70 180 150 - - Low stress and high flow
- Improved work life
- Good pressure pot performance with low shrinkage
- Excellent moisture and chemical resistance
- Oven cure
Loctite ABLESTIK 8387BM High throughput encapsulation applications 14,000 PTFE, Silica 10 Hybrid Epoxy 122 88 168 5 or 60 150 or 100   - Non conductive
- Black pigmentation for blocking stray light
Loctite ECCOBOND FP4660 CSP and low stress applications 120,000 at 5 rpm Silica (80%) - - 135 13 56 30 + 90 125+165 - - Low stress
- Excellent chemical resistance and thermal stability
- Jettable
- Oven cure
Loctite ECCOBOND UV8800M CSP, BGA and SmartCard 2,500 - 4,000 at 5 rpm Silica (54%) 21 - 29 41 135 2 seconds 315 - 400 nm (UV) Yes - Good pressure pot performance with low shrinkage
- Excellent surface cure with adhesion to a wide range of substrates
- Accurate dispensing with excellent shape control
- UV cure
Loctite EO7021 CSP, BGA and SmartCard 17,000 at 5 rpm - - - 125 67 187 60 or 5 120 or 150 Yes - One component
- Fast oven cure at moderate temperatures


Learn More

Liquid resins are used in two main ways in encapsulations processes: glob top and dam & fill alternatively known as frame & fill./> <caption>Liquid resins are used in two main ways in encapsulations processes: glob top and dam & fill alternatively known as frame & fill</caption> </div><div class=

Epoxy Mold Compound vs Liquid Encapsulation

There are two main ways to encapsulate a semiconductor device: transfer molding a thermosetting Epoxy Mold Compound (EMC) or using liquid encapsulation directly on the Printed Circuit Board (PCB). Encapsulation in EMC is better than liquid encapsulation for applications that require higher filler content, and for the same reason, volume for volume, EMC is usually cheaper than liquid.

Liquid encapsulation, on the other hand, has a high flexibility and low through put

Liquid casting is however much more flexible. EMC requires are large significant investment in molding machines and mold plates for specific devices which must produce large quantities before there is a return on that investment. Liquid encapsulation on the other hand has a high flexibility and low through put: meaning that it is best suited for a multiple diverse low quantity orders.

In general liquid encapsulation is used for LEDs and potting or encapsulating electronics in bare die mounting on printed circuit boards (PCB), otherwise known as chip on board (COB).

Another advantage of potting and encapsulating devices in liquids is that in general, the result is flatter and thinner than devices encapsulated by a transfer molding process around a lead-frame with EMC. The space requirements for devices will continue getting more and more stringent as the component density of devices increases. This trend makes encapsulation and potting in liquids a sure bet for the future.

Transfer molding EMC may also cause wire sweep: where the pressure of the flowing molten compound shifts the fine-pitched bonding wires connecting a die. Wire sweep can cause shorts and mutual inductance. Liquid encapsulation is applied from above and does not disturb bonding wires. That’s why it is the industry standard for larger or extra sensitive dies and chips.

Liquid resin encapsulation via the glob top process is a single step application process but is less precise than dam & fill /> <caption>Liquid resin encapsulation via the glob top process is a single step application process but is less precise than dam & fill</caption> </div><div class=

Liquid Epoxy: Viscosity and Thixotropy

Bare die may be mounted to the PCB with die attach but that’s not enough to protect them or their connecting wires from moisture, mechanical stress, temperature, and chemical corrosion. That’s why it makes sense to insulate and encapsulate them with a protective potting layer of liquid encapsulant.

The low viscosity of liquid encapsulants is good for flat smooth finishes.

In non-Newtonian thixotropic encapsulants thixotropy refers to the temporarily lower viscosity of an epoxy gel when shear, pressure, or temperature is applied. This means that they can be gel-like when at rest, but flow like a liquid when agitated.

Being able to control the viscosity of liquid encapsulants means you can dial in how far they will spread over a surface area, and also how high they will build up to. This is important in Glob Top encapsulation where devices are literally encapsulated by a “Glob” from above.

Dam & Fill or Frame & Fill is a two step encapsulation process that is a little like 3d printing./> <caption>Dam & Fill or Frame & Fill is a two step encapsulation process that is a little like 3d printing</caption> </div><div class=

Glob Top vs Dam & Fill

Glob Top is a process of encapsulation by using a fluid encapsulant gel with higher viscosity so that it fully encapsulates a device without flowing beyond the necessary area. As mentioned, by controlling the temperature, shear, and pressure, the viscosity and flow of liquid can be adjusted so that the final surface area and height of the “Glob” can be controlled quite effectively.

Dam & Fill on the other hand refers to a two-step process of encapsulation, where a ring or frame of higher viscosity liquid encapsulant is applied as a “Dam” around a device, and then a lower viscosity liquid “fill” is used to then fully encapsulate a device. The liquid used to build the frame or dam usually has more abrasive filler and a higher viscosity at rest than the liquid used for the fill.

Dam & Fill is a more selective protective coating and can be framed to cover areas in specific shapes, and is for example also used for optical bonding. In optical bonding the frame or dam is used to create a space between the glass and the display or touch screen. Then an optically clear fill is used as an adhesive and fixative.

Liquid Encapsulation for LEDs and Optoelectronic devices:

Optically clear liquid encapsulation is also used for LED devices, and encapsulate optical or optoelectronic devices that require both a high level of light transmittance as well as a good level of mechanical protection. In a similar process to Glob Top encapsulation, a literal glob of clear encapsulant is dropped directly into place on top of the LED. In another production process, optically clear liquid encapsulant is used to cast LED’s final body. Phosphor, colored dyes, and diffusant concentrates can be added to the liquid encapsulant to alter its optical properties.